International Business Machines Corporation

Harald Pross

Jesse Paul Arroyo

Thomas R Sand

Ellen Marie Bauman

Christopher John Engel

Gregory Michael Nordstrom

Timothy Roy Block

Kaveh Naderi

Michael F McAllister

Gerhard H Ruehle

Wolfgang A Scholz

Gerhard Schoor

Curtis Shannon Eide

William Alan Thompson

Erich Klink

Richard Burton Finch

Gerald Stanquist

Daniel Morgan Crowell

Helmut Kohler

Rene Schrottenholzer

James S Fields

Christoper J Engel

Manfred Cwik

A method, system and computer program product are provided for detecting state and sparing of optical Peripheral Component Interconnect Express (PCI-Express or PCIE) cable channels attached to an IO drawer. System firmware is provided for implementing health check functions and state detection and sparing functions. One or more optical cables are connected between a host bridge and an PCIE enclosure, each optical cable includes one or more spare optical channels. An identified failed optical channel is rerouted to the spare optical channel.

Detecting and sparing of optical PCIE cable channel attached IO drawer

A method, system and computer program product are provided for detecting and configuring an external input/output (IO) enclosure in a computer system. A PCIE Host Bridge (PHB) in a system unit is connected to a plurality of PCIE add-in card slots. One or more cables are connected between the PHB and the external enclosure. System firmware including detecting and configuring functions uses sideband structure for detecting a PCIE cable card and configuring the external input/output (IO) enclosure.

Detecting and configuring of external IO enclosure

A method, system and computer program product are provided for implementing health check for optical cable attached Peripheral Component Interconnect Express (PCIE) enclosures in a computer system. System firmware is provided for implementing health check functions. One or more optical cables are connected between a host bridge and a PCIE enclosure. A PCIE link to the PCIE enclosure is reset responsive to a predefined event. After a set delay, a PCIE link health check is performed verifying PCIE link width and speed.

Implementing health check for optical cable attached PCIE enclosure

A method, system and computer program product are provided for detecting state and sparing of optical Peripheral Component Interconnect Express (PCI-Express or PCIE) cable channels attached to an IO drawer. System firmware is provided for implementing health check functions and state detection and sparing functions. One or more optical cables are connected between a host bridge and a PCIE enclosure, each optical cable includes one or more spare optical channels. An identified failed optical channel is rerouted to the spare optical channel.

A testing backplane apparatus includes first test ports configured to receive a first processor assembly under test and the plurality of first test ports may be an even number of first test ports or an odd number of first test ports. The testing backplane apparatus includes second test ports, where each first test port corresponds to a second test port and the second test ports connect to a second processor assembly. The testing backplane apparatus includes a signal pathway from each first test port to a second test port. The signal pathway includes a signal path length within a range between a maximum signal path length and a minimum signal path length. Each port on the first processor assembly corresponds to each port on the second processor assembly and the testing backplane apparatus is configured differently from a backplane used as a final destination for operating the first processor assembly.

Testing a processor assembly

A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Gel package structural enhancement of compression system board connections

Method for structural enhancement of compression system board connections

Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener

According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.

Low inductance multiple resistor EC capacitor pad

The semiconductor memory module comprises a housing of plastic or ceramic in which two chips are stacked together back-to-back. The pads of the chips are electrically connected by wire bonding to beam leads which comprise outer bond leads, generally arranged outside the housing to form the contact pins or contact leads of the module to a printed circuit board, and inner bond leads in the housing. The inner bond leads are split and spread in the area of the inner lead bond ends into upper and lower sets forming a gap for receiving and holding the stacked chips.

High density semiconductor memory module using split finger lead frame

Growing community of inventors

Wildberg, Germany

Harald Pross