Semikron Elektronik Gmbh &co.kg

Semikron Danfoss Elektronik Gmbh & Co., Kg

Wagner, Michael

Kobolla, Harald

Semikron Elektronik Gmbh & Co. Kg Patentabteilung

Harald Kobolla

Jörg Ammon

Jürgen Steger

Ingo Bogen

Rainer Popp

Peter Beckedahl

Marco Lederer

Christian Göbl

Alexander Wehner

Sandro Bulovic

Stefan Weiss

Christian Kroneder

Gunter Königsmann

Stefan Schmitt

Björn Tauscher

André Schlötterer

Stefan Oehling

Christian Zeller

Bernhard Kalkmann

Matthias Hager

Alexej Walter

Jürgen Riegel

Johannes Krapp

Florian Fink

Frank Stiegler

Verena Gulitsch

Michael Wagner

A power semiconductor module has a base plate with a housing and a switching device. The switching device has a substrate and a connecting device with a first and a second main face. A group of power semiconductor components is arranged on a conductor track of the substrate, and has a group midpoint. A pressure device is formed on the substrate in the normal direction to exert pressure, which pressure device has a pressure body and a pressure inducing body, wherein a pressure element is arranged protruding from the pressure body, wherein the pressure element presses onto a pressure section of the second main face of the connecting device, and wherein the pressure inducing body has a pressure transmission section with a pressure transmission point.

Power semiconductor module having a pressure device acting on a switching device

A power electronic arrangement has a power converter module including a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and has a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection. The second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection. The second DC voltage terminal element or the second DC voltage connection element has a continuous welding cavity in the region of the first connection.

Power electronic arrangement with DC voltage connection element and method for its production

A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

Liquid cooling device for the arrangement of a power semiconductor device

An arrangement having a housing and an electrically conductive contact spring is presented, wherein the contact spring has a first and a second orthogonal main plane along its specified spring direction, wherein it is formed so as to be symmetric with respect to the first main plane, x-z plane, and asymmetric with respect to the second main plane, x-y plane, and also with respect to a rotation through 180° about the specified spring direction. The housing has a spring shaft for receiving the contact spring, and wherein this spring shaft likewise has a first and a second main plane, which coincides with the respective main plane of the contact spring, and wherein the spring shaft is formed so as to be symmetric relative to both main planes. And a power semiconductor module having such an arrangement.

Arrangement having a housing and an electrically conductive contact spring, and power semiconductor module having said arrangement

A module and a power semiconductor device wherein a module is configured with a molded plastic body and load terminal elements of the power semiconductor device, wherein respective load terminal elements are configured as a flat shaped metal body having a first main face and an opposite second main face, and having a first secondary face and an opposite second secondary face. The secondary faces connect the main faces, and have a terminal section, wherein the molded plastic body forms channels and comprises a bottom body part, a first and a second edge body and a partition body. The load terminal elements are arranged with a section in an associated channel, and an edge body of the channel has an indentation directed towards the one main face of the directly neighboring terminal element.

Module having a moulded plastic body and a multiplicity of load terminal elements and power semiconductor device therewith

A power converter module has a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and having a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection, wherein the second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection.

A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

Power electronic assembly with an electrically conductive sleeve and with a circuit carrier

A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Power semiconductor module and method for arranging said power semiconductor module

The invention relates to a power semiconductor device comprising a pin element which passes through a housing opening, comprising a support device, further comprising an elastic sealing device which is arranged on the support device, comprising a pressure device which is arranged on the sealing device, and comprising an electrically conductive sleeve. A first pressure element of the pressure device presses a first sealing element of the sealing device against a first support element of the support device in the axial direction of the pin element causes deformation of the first sealing element so that the first sealing element presses against the housing opening wall and against the sleeve in a perpendicular direction in relation to the axial direction of the pin element. A second pressure element of the pressure device is designed to press a second sealing element of the sealing device against a second support element of the support device in the axial direction of the pin element and in this way to cause deformation of the second sealing element in such a way that the second sealing element presses against the sleeve and against the pin element in a perpendicular direction in relation to the axial direction of the pin element.

Power semiconductor device comprising a power semiconductor component and a housing

A power electronic switching device having plurality of potential surfaces. At least two different potentials are respectively assigned to at least one of the potential surfaces. A plurality of semiconductor components are arranged in an n&#xd7;m matrix, oriented in the x-y-direction, on a first conductor track, formed by at least one potential surface of the first potential. The semiconductor components are connected in parallel with one another and form a current valve. In this case, the semiconductor components can be distributed among a plurality of potential surfaces of the first potential which form the first conductor track.

Power electronic switching device comprising a plurality of potential surfaces

The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.

Device, method, and system for cooling a flat object in a nonhomogeneous manner

A switching device has a substrate, a power semiconductor component arranged thereon, a connection device and a pressure device. The substrate has conductor tracks electrically insulated from each another. A power semiconductor component is arranged on one of the conductor tracks. The connection device is embodied as a film composite having an electrically conductive film and an electrically insulating film and forming a first and a second main surface. The switching device is connected in a circuit-conforming manner by the connection device, and a contact area of the first main surface of the power semiconductor component is connected to a first contact area of an assigned conductor track of the substrate in a force-locking and electrically conductive manner.

Power electronic switching device, arrangement herewith and methods for producing the switching device

A submodule and an assembly include a switching device having a substrate, and printed conductors arranged thereupon. The submodule incorporates a first and a second DC voltage printed conductor, to which a first and a second DC voltage terminal element are connected in an electrically conductive manner, and an AC voltage printed conductor, to which an AC voltage terminal element is connected in an electrically conductive manner. The submodule further comprises an insulating moulding, which encloses the switching device in a frame-type arrangement. The first DC voltage terminal element, by means of a first contact section, engages with a first supporting body of the insulating moulding, and the AC voltage terminal element, by means of a second contact section, engages with a second supporting body of the insulating moulding. To this end, a first clamping device is configured to project through a first recess in the first supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the first DC voltage terminal element and an associated first DC voltage connecting element, and a second clamping device is configured to project through a second recess in the second supporting body, in an electrically insulating manner, and to form an electrically-conductive clamping connection between the AC voltage terminal element and an associated AC voltage connecting element.

Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof

A switching device has a substrate and a power semiconductor component, comprising a connection device and a pressure device wherein the substrate has tracks electrically insulated from one another. The power semiconductor component is on one of the tracks with a first main surface and is conductively connected thereto. The device is embodied as a film composite having a conductive film and an insulating film that forms a first and a second main surface. The switching device is connected internally in a circuit-conforming manner by the connection device and a contact area of the connection device is connected to a first contact area of one of the tracks in a force-locking and electrically conductive manner. There is a pressure body projecting to the substrate and pressing onto a first section of the second main surface of the film composite.

A switching device has a substrate, a connection device and a pressure device, wherein the substrate has electrically insulated conductor tracks, and a power semiconductor component is on one of the conductor tracks with a first main surface and is conductively connected thereto. The connection device is a film composite with conductive film and an insulating film and forms a first and a second main surface. The switching device is connected by the connection device and a contact area of the second main surface of the power semiconductor component is connected to a first contact area of the first main surface of the connection device in a force-locking and electrically conductive manner with a pressure body and a pressure element projecting toward the power semiconductor component.

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Seukendorf, Germany

Harald Kobolla