Infineon Technologies Ag

Harald Gundlach

Walter Kargl

Gerald Holweg

Jochen Müller

J&uuml;rgen Fischer

Andreas Muller-Hipper

Ewald Simmerlein-Erlbacher

Thomas Muench

Andreas Müller-Hipper

Michael Hochholzer

Jens Riedel

A smart card contains a carrier body for receiving at least one system component, which has (in each case) a plurality of electrical components, and which unites the electrical functions for the operation of the smart card. The system component terminates approximately evenly with the top side of the card body of the smart card. At least one of the electrical components is accessible from the top side of the smart card.

Smart card containing a carrier body for receiving at least one system component having a plurality of electrical components and uniting electrical functions for operating the smart card

A chip card module is provided for insertion into a card body. The chip card module has at least one component, for example a keypad, fitted on an intermediate carrier configured in the card body. The intermediate carrier is a functional constituent part of the at least one component.

Chip card module

Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.

Process for producing a metal layer on a substrate body, and substrate body having a metal layer

The chip module comprises a semiconductor chip, which is fixed on a main side of a substrate of planar extent. A component, which is provided for taking up, emitting, reflecting or partially shielding electromagnetic radiation, e.g., a radiation sensor or an optical display device (display), is provided on the same main side of the substrate and is connected to the semiconductor chip. The substrate is transmissive to the relevant radiation to a sufficient extent and at least in a region occupied by the component.

Chip module

A contactless data storage medium has at least two antennas, in each case for different transmission bands. This makes it possible to configure a data storage medium such that it can be operated with read/write units that operate in accordance with different standards. At least two of the antennas form a unit, so that a configuration such as this can be produced at very low cost.

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Grünwald, Germany

Harald Gundlach