Growing community of inventors

Boise, ID, United States of America

Haoyu Li

Average Co-Inventor Count = 5.65

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 5

Haoyu LiYongjun Jeff Hu (9 patents)Haoyu LiEverett Allen McTeer (6 patents)Haoyu LiChristopher W Petz (6 patents)Haoyu LiJohn Mark Meldrim (5 patents)Haoyu LiDaniel Billingsley (5 patents)Haoyu LiYiping Wang (5 patents)Haoyu LiAndrew Li (4 patents)Haoyu LiMatthew J King (3 patents)Haoyu LiDavid Ross Economy (3 patents)Haoyu LiWei Yeeng Ng (3 patents)Haoyu LiSilvia Borsari (2 patents)Haoyu LiStian E Wood (2 patents)Haoyu LiJohn David Hopkins (1 patent)Haoyu LiChet E Carter (1 patent)Haoyu LiCollin Howder (1 patent)Haoyu LiAlyssa N Scarbrough (1 patent)Haoyu LiM Jared Barclay (1 patent)Haoyu LiGrady S Waldo (1 patent)Haoyu LiBhavesh Bhartia (1 patent)Haoyu LiHaoyu Li (12 patents)Yongjun Jeff HuYongjun Jeff Hu (233 patents)Everett Allen McTeerEverett Allen McTeer (62 patents)Christopher W PetzChristopher W Petz (35 patents)John Mark MeldrimJohn Mark Meldrim (64 patents)Daniel BillingsleyDaniel Billingsley (22 patents)Yiping WangYiping Wang (17 patents)Andrew LiAndrew Li (16 patents)Matthew J KingMatthew J King (51 patents)David Ross EconomyDavid Ross Economy (23 patents)Wei Yeeng NgWei Yeeng Ng (17 patents)Silvia BorsariSilvia Borsari (25 patents)Stian E WoodStian E Wood (2 patents)John David HopkinsJohn David Hopkins (238 patents)Chet E CarterChet E Carter (50 patents)Collin HowderCollin Howder (46 patents)Alyssa N ScarbroughAlyssa N Scarbrough (36 patents)M Jared BarclayM Jared Barclay (13 patents)Grady S WaldoGrady S Waldo (13 patents)Bhavesh BhartiaBhavesh Bhartia (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (12 from 37,542 patents)


12 patents:

1. 12256546 - Integrated assemblies and methods of forming integrated assemblies

2. 12200929 - Integrated circuitry comprising a memory array comprising strings of memory cells and method used in forming a memory array comprising strings of memory cells

3. 11844220 - Integrated assemblies and methods of forming integrated assemblies

4. 11729964 - Methods of forming an apparatus including laminate spacer structures

5. 11621273 - Integrated assemblies and methods of forming integrated assemblies

6. 11527548 - Semiconductor devices and electronic systems including an etch stop material, and related methods

7. 11164873 - Apparatuses including laminate spacer structures, and related memory devices, electronic systems, and methods

8. 10916564 - Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars

9. 10700091 - Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars

10. 10546848 - Integrated assemblies and methods of forming integrated assemblies

11. 10355014 - Assemblies having vertically-extending structures

12. 10354989 - Integrated assemblies and methods of forming integrated assemblies

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as of
9/9/2025
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