Delta Electronics (shanghai) Co., Ltd

Delta Electronics, Inc.

Haoyi Ye

Jianhong Zeng

Xiaoni Xin

Shouyu Hong

Yiqing Ye

Zhiheng Fu

Peiqing Hu

Pengkai Ji

Min Zhou

Chaofeng Cai

Jinping Zhou

Ziying Zhou

Jianping Ying

Teng Liu

Chao Yan

Rui Wu

Yu-Ching Kuo

Tong-Sheng Pan

Wen-Yu Lin

Hongyang Wu

Yuan Zhou

Huayao Bao

Siyu He

Yu Zhang

Xinjian Zou

Fan Li

Qingdong Chen

Jian Zeng

Aiming Xiong

Jiale Dai

Yan Chen

A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.

Transformer module and power module

The present disclosure provides an assembly structure for providing power for a chip. The assembly structure includes a circuit board configured to provide a first electrical energy; a chip provided with at least one electrical energy input terminal; and a first power converting module provided with at least one power output terminal. The first power converting module is electrically connected to the circuit board and the chip, converts the first electrical energy to a second electrical energy, and supplies the second electrical energy to the chip. The circuit board, the chip and the first power converting module are stacked; and a projection of the at least one electrical energy input terminal of the chip on the circuit board and a projection of the at least one the power output terminal of the first power converting module on the circuit board, are at least partially overlapped.

Assembly structure

A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.

Power supply system and power supply module

The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first wiring layer, a first insulating layer and a second wiring layer, where the first wiring layer, the first insulating layer and the second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer, where at least part of the first metal winding is wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; a second metal winding, formed in the second wiring layer and wound around the magnetic core, where the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.

The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.

A system of providing power to a chip on a mainboard includes: a first power supply, located on the mainboard, and being configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard and disposed at different sides of the chip, each of the second power supply and the third power supply is electrically connected to the first power supply to receive the second voltage, the second power supply provides a third voltage to the chip, the third power supply provides a fourth voltage to the chip, and Z≤5*(Z+Z), Zis bus impedance between the first power supply and the third power supply, Zis equivalent output impedance of the third power supply, and Zis transmission impedance between the third power supply and the chip.

System of providing power to chip on mainboard

Power supply system

The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core in a foil structure, and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core in a foil structure, comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring.

The disclosure provides a system of providing power to a chip on a mainboard, including: a first power supply, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard, wherein the second power supply and the third power supply are electrically connected to the first power supply; so as to receive the second voltage, the second power supply is disposed at a first side of the chip, the third power supply is disposed at a second side of the chip, the second power supply provides a third voltage to the chip, and the third power supply provides a fourth voltage to the chip.

The invention provides a conversion circuit for converting input voltage into output voltage, including: a full-wave rectifier circuit including first and second branches connected in parallel, and each including a secondary winding and a rectifier switch; a first switch branch connected to midpoint of the first branch, and including first to fourth switches connected in series; a first resonant unit connected between connection node of the first and second switches and midpoint of the second branch; a second resonant unit connected between connection node of the third and fourth switches and midpoint of the second branch; a first primary winding connected in series to the first resonant unit; and a capacitor connected between connection node of the second and third switches and midpoint of the second branch. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

Conversion circuit topology

The invention provides a conversion circuit for converting input voltage into output voltage, including: a full-bridge rectifier circuit including first and second bridge arms connected in parallel and electrically connected between first and second ends of the output voltage; a first switch branch electrically connected between the first end of the input voltage and the first end of the output voltage, and including first and second switches connected in series to form a first connection node; a first resonant unit electrically connected between the first connection point and midpoint of the first bridge arm; and a first transformer including a first primary winding connected in series with the first resonant unit; and a first secondary winding connected between midpoint of the first bridge arm and midpoint of the second bridge arm. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

Assembly structure and electronic device having the same

The invention provides a conversion circuit for converting an input voltage into an output voltage, including: a first full-wave rectifier circuit including a first branch and a second branch connected in parallel, each including a winding and a rectifier switch connected in series to form a midpoint; a first switch branch including a first switch and a second switch connected in series to form a first connection node; and a first resonant unit connected between the first connection node and a midpoint of the second branch, wherein the first resonant unit is not connected in series to the windings of the transformer. The conversion circuit of the invention improves conversion efficiency while maintaining smaller voltage stress on switches.

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Shanghai, China

Haoyi Ye