United Microelectronics Center Co., Ltd

Haopeng Wang

Miao Wang

Wenlong Jiao

Weimong Tsang

Ruifeng Yang

Chuting Zhang

Huaiwang Zeng

Bin Zhang

The present disclosure provides a flexible integrated array sensor and manufacturing methods thereof. The array sensor includes a silicon wafer, a readout circuit layer, a sensing array layer, and a polymer substrate layer disposed on the silicon wafer. The manufacturing method includes: preparing a silicon wafer; fabricating a plurality of function arrays, each including m*n function units, on a surface of the silicon wafer; etching one or more deep grooves on the surface of the silicon wafer between the arrays; fabricating a thinning support; and thinning a bottom surface of the silicon wafer to a target thickness so that the arrays are separated from each other. The etching depth for etching the one or more deep grooves is equal to or greater than the thickness of the silicon wafer after thinning.

Wafer-level manufacturing process of a flexible integrated array sensor

Growing community of inventors

Chongqing, China

Haopeng Wang