Applied Materials, Inc.

Haojiang Chen

Harald Herchen

James S Papanu

Mark Naoshi Kawaguchi

David Palagashvili

Jeng H Hwang

Guangxiang Jin

A method of processing a substrate comprises exposing the substrate to an energized process gas to etch features on the substrate and exposing the substrate to an energized cleaning gas to remove etchant residue and/or remnant resist from the substrate . To enhance the cleaning process, the substrate may be treated before, during or after the cleaning process by exposing the substrate to an energized treating gas comprising a halogen species.

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Cupertino, CA, United States of America

Haojiang Chen