Huawei Technologies Co., Limited

Honor Device Co., Ltd.

Haohui Long

Yang Zhou

Jianping Fang

Hui Si

Taixiang Liu

Runqing Ye

Yanlin Wang

Jianhui Li

Yanfeng Liang

Shanshan Wei

Hongbin Shi

Lin Qu

Yunfei Wang

Xiaochen Chen

Xiong Yang

Shi Zhang

Xuan Cao

Zhuqiu Wang

Xiaolong Li

Yuanjian Liu

Weiqiang Hong

Yanqin Liao

Yingbo Zhao

This application provides a display panel, a display screen including the display panel, and an electronic device including the display screen. The display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Display panel and manufacturing method therefor, display screen, and electronic device

A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Display module and electronic device

An electronic device comprises a processor, a charging port, and memory that stores program code. When the program code is executed by the processor, the electronic device charges a battery of the electronic device using the charging port when a charger is connected to the charging port, stops charging in response to detecting that the charging port is abnormal, and displays a first window on a display interface of the electronic device in response to detecting that the charging port is abnormal. The first window comprises a first prompt information and a second prompt information. The first prompt information is used to prompt that liquid intake exists in the charging port, and the second prompt information is used to prompt a user to exclude a liquid intake situation of the charging port.

Charging method and related device

An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

Display apparatus, method for manufacturing display apparatus, and electronic device

A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

Display module and display device

A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

Electronic package, terminal and method for processing electronic package

A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

Chip package structure having a package substrate disposed around a die

A charging method and a related device are provided. A charge protection apparatus includes a micro control unit MCU, a current detection circuit, a gating circuit, and an I/O interface. The current detection circuit detects an external charging current flowing through a power cable. The current detection circuit transmits the external charging current to the MCU. The MCU transmits the external charging current to a user terminal by using the I/O interface, so that the user terminal calculates a current difference between the external charging current and an internal charging current detected by the user terminal, and determines, based on the current difference, whether to generate a circuit control command. The MCU receives the circuit control command sent by the user terminal, and controls, according to the circuit control command, the gating circuit to be in a closed state or an open state.

A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

High-reliability electronic packaging structure, circuit board, and device

A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

Apparatus equipped with crack detection circuit and detection system

In one example implementation, a sensor apparatus includes a bracket, a first polar plate, a first contact portion, a first leading wire, a rotating shaft, a support frame, a second polar plate, a second contact portion, and a second leading wire. The bracket is of a cylindrical structure with two open ends. The first leading wire is disposed on the first polar plate and an external side of the bracket, one end of the first leading wire is connected to the first contact portion, and the other end of the first leading wire is connected to the first polar plate. The second contact portion is disposed at a first end of the support frame. The second leading wire is disposed on the support frame and the second polar plate.

Sensor apparatus

A charging method and a related device are provided. A charge protection apparatus includes a micro control unit (MCU), a current detection circuit, a gating circuit, and an input/output (I/O) interface. The current detection circuit detects an external charging current flowing through a power cable. The current detection circuit transmits the external charging current to the MCU. The MCU transmits the external charging current to a user terminal using the I/O interface such that the user terminal calculates a current difference between the external charging current and an internal charging current detected by the user terminal, and determines, based on the current difference, whether to generate a circuit control command. The MCU receives the circuit control command from the user terminal, and controls, according to the circuit control command, the gating circuit to be in a closed state or an open state.

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Beijing, China

Haohui Long