Hisense Hiview Tech Co., Ltd.

Haode Jiang

Dejun Wang

Wangjun Zhang

A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.

Growing community of inventors

Qingdao, China

Haode Jiang