Avery Dennison Corporation

Avery Dennison Retail Information Services, LLC

Avery Denninson Corporation

Haochuan Wang

Ali Reza Mehrabi

Kouroche Kian

Ian J Forster

David Nicholas Edwards

Liviu Dinescu

Jay Raghunandan Akhave

Mark Anthony Licon

David Charles Welch

Dave N Edwards

Akiko Tanabe

Kai Yi Li

Sriram Venkatasanthanam

Dong-Tsai Hseih

Steven R Chapman

Pradeep S Iyer

Chia-Hsi Chu

Frank Yenjir Shih

Stephen Li

Zhisong Huang

Christine U Dang

Adrian J Hulme

Nagarajan Srivatsan

Xiaoming He

Ekaterina Vaskova

Juan M De Santos Avila

Srikant Pathak

Timothy L Paris

James Johnson

Kai Li

Chia-His Chu

Adrian L Hulme

The present invention relates to an interactive advertising system and method of using the system. A plurality of removable RFID devices are disposed on a panel which is separate from an advertising graphic that is supported in an illuminated frame. Activation of one of the RFID devices illuminates a portion of the advertising graphic.

RFID/NFC panel and/or array used in smart signage applications and method of using

The present invention relates to an advertising system and method of using the same. The advertising system includes a light source which may be activated by near field communication devices in order to extract information from the system.

Smart sign box using electronic interactions

An erasable and/or reusable image receiving medium () is disclosed along with a system () and/or method for using the same, including a unit () and/or method for erasing the reusable medium ().

Reusable printing medium and apparatus and method employing the same

Methods and/or systems for printing or otherwise evincing temporary indicia on media with disappearing inks are described along with suitable disappearing ink formulations and media constructions for executing the same. In particular embodiments, the methods and/or systems described employ a plurality of disappearing inks with different disappearing rates. In one embodiment, a barrier layer that is selectively used to cover a major surface of the media is employed to substantially block or otherwise regulate a rate of phase transitions (e.g., evaporation and/or sublimation) experienced by ink borne by the media.

Systems, methods, and materials for temporary printing and indicia

A heat-transfer imaging system and a method of using the same. The heat-transfer imaging system includes a heat-transfer sheet and an activating ink. The heat-transfer sheet and the activating ink are specially formulated so that only the areas of the heat-transfer sheet onto which the ink has been printed become adhesive under heat-transfer conditions. This effect may be achieved by designing the sheet to include an ink-receptive coating whose melting temperature is higher than that typically encountered during normal heat-transfer conditions and by formulating the activating ink to include a plasticizer that, when printed onto the ink-receptive coating, lowers the melting temperature of the ink-receptive coating sufficiently so that the modified melting temperature falls within the temperature range encountered during heat-transfer.

Selective heat-transfer imaging system and method of using the same

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Method and apparatus for creating RFID devices

A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Method and apparatus for linear die transfer

Growing community of inventors

S. Pasadena, CA, United States of America

Haochuan Wang