Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Hongqisheng Precision Electronics (qinhuangdao) Co., Ltd.

Garuda Technology Co., Ltd.

Hao-Wen Zhong

Biao Li

Ning Hou

Ming-Jaan Ho

Xiao-Wei Kang

Cheng-yi Yang

Yao-Cai Li

Man-Zhi Peng

Ming-Hui Wang

An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Embedded circuit board and manufacturing method thereof

A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

Flexible circuit board

An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

Flexible circuit board and method for manufacturing same

A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.

Flexible printed circuit board, method for manufacturing the same and loudspeaker with the same

A bendable circuit board includes a first rigid wiring board, a first flexible film, a circuit substrate, a second rigid wiring board, a second flexible film, and a third rigid wiring board which are stacked in said order. The circuit substrate is a rigid double-sided circuit board. The first rigid wiring board defines a first window area in which the first flexible film is exposed, and the third rigid wiring board defines a second window area in which the second flexible film is exposed. The present disclosure further provides a method for manufacturing the bendable circuit board.

Bendable circuit board and method for manufacturing the same

A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.

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Shenzhen, China

Hao-Wen Zhong