Industrial Technology Research Institute

Hao-Wei Yu

Hung-Hsien Ko

Te-Hsun Lin

Heng-Yin Chen

Chen-Tsai Yang

Yi-Cheng Lu

I-Hung Chiang

Min-Hsiung Liang

A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

Flexible hybrid electronic substrate and electronic textile including the same

Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.

Circuit apparatus, manufacturing method thereof and circuit system

Growing community of inventors

Taipei, Taiwan

Hao-Wei Yu