TSMC Solid State Lighting Ltd.

Epistar Corporation

Hao-Wei Ku

Hsin-Hung Chen

Yu-Sheng Tang

Hsiao-Wen Lee

Chung Yu Wang

Ching-Yi Chen

Hao-Yu Yang

Sheng-Shin Guo

Chi Xiang Tseng

Shang-Yu Tsai

Tien-Ming Lin

Tien-Min Lin

An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

Wafer level reflector for LED packaging

A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.

Light-emitting diode (LED) package systems and methods of making the same

Growing community of inventors

Zhudong, Taiwan

Hao-Wei Ku