Taiwan Semiconductor Manufacturing Comp. Ltd.

Au Optronics Corporation

Hao-Wei Chang

Yen-Ming Chen

Sheng-Liang Pan

Kai-Ming Ching

Shih-Wu Yuan

Chun-Hong Chang

Jen-Shang Fang

Ching-Kun Hung

The present invention provides a backlight module including a back bezel and a frame. The back bezel is provided with a wall disposed along a first side of the back bezel. The wall is provided with a first wall portion and a second wall portion alternately arranged along the first side, and the first wall portion and the second wall portion are each provided with an inner side surface and an outer side surface opposite to the inner side surface. In the backlight module, the inner side surface of the second wall portion protrudes toward the interior of the back bezel more than the inner side surface of the first wall portion. The frame extends at least partially along the first side and is positioned on the wall. The frame is provided with a first frame wall and a second frame wall alternately arranged and protruding toward a base of the wall. In the backlight module, the first frame wall correspondingly abuts against the inner side surface of the first wall portion, and the second frame wall correspondingly abuts against the outer side surface of the second wall portion.

Backlight module

Within both a method for forming a patterned photoresist layer and a method for forming an electroplated patterned conductor layer while employing the patterned photoresist layer as a patterned photoresist plating mask layer there is first provided a substrate. There is then formed over the substrate a blanket photoresist layer formed of a negative photoresist material. There is then photoexposed the blanket photoresist layer to form a photoexposed blanket photoresist layer while employing a photoexposure apparatus which employs an annular edge ring exclusion apparatus positioned over an annular edge ring of the blanket photoresist layer and the substrate. Finally, there is then developed the photoexposed blanket photoresist layer to form a patterned photoresist layer having an annular edge ring excluded over the annular edge ring of the substrate. By employing within the context of the present invention the annular edge ring exclusion apparatus, the electroplated patterned conductor layer is formed with enhanced thickness uniformity.

Selective electroplating method employing annular edge ring cathode electrode contact

An apparatus and a method for sealingly engaging an upper chamber lid and a lower chamber lid of a vacuum process chamber together without leakage are provided. In the apparatus, an upper chamber lid is connected to a support frame by an universal joint such that a perfect alignment between the upper chamber lid and the lower camber lid can be achieved by making 360&deg; movement of the upper chamber lid. The support frame is further provided with a plurality of compressible spring members, i.e., at least 3 or 4 spring members that are mounted to the support frame and projected downwardly for pressing on a top surface of the upper camber lid and achieving a vacuum-tight seal between the upper lid and the lower lid. The novel use of the universal joint and the plurality of compressible springs therefore enables the present invention apparatus to achieve a vacuum-tight seal between two chambers halves in a vacuum process chamber.

Apparatus and method for sealing a vacuum chamber

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Hsin-Chu, Taiwan

Hao-Wei Chang