Northeastern University

Shenyang Kingsemi Co., Ltd.

Shenyang University of Technology

China Northeast Architectural Design & Research Institute Co., Ltd

China West Construction Building Materials Science Research Institute Co., Ltd

China Construction Technology Group Co., Ltd

Hao Wang

Weifeng Zhang

Tianyao Wu

Tao Miao

Xiaowei Gu

Xinglong Chen

Xiaohui Li

Zhangmiao Li

Peng Liu

Yuxin Gao

Baokuan Ning

Xinlong Zhang

Qingdong Liu

Jianping Liu

The present invention provides a wafer transfer device. The wafer transfer device comprises a first supporting mechanism and a second supporting mechanisms, wherein the first supporting mechanism and the second supporting mechanism are arranged side by side along a translation direction, and two opposite outer side walls of the first supporting mechanism and the second supporting mechanism are each provided with a picking-conveying guide structure arranged along a telescopic direction perpendicular to the translation direction; a first picking-conveying mechanism and a second picking-conveying mechanism which are movably arranged at the picking-conveying structure of the first supporting mechanism and the picking-conveying guide structure of the second supporting mechanism respectively, wherein each of the first picking-conveying guide structure and the second picking-conveying guide structure comprises a tail end execution part, and the tail end execution part of the first picking-conveying mechanism and the tail end execution part of the second picking-conveying mechanism are oppositely arranged along a lifting direction and face opposite directions, thus transferring a plurality of wafers in two directions. The present invention further provides a wafer transfer method.

Wafer transfer device and wafer transfer method

The wafer transfer device includes a first supporting mechanism, a second supporting mechanism, a first picking-conveying mechanism and a second picking-conveying mechanism, wherein the first picking-conveying mechanism and the second picking-conveying mechanism include tail end execution parts facing opposite directions. The wafer transfer device further includes a rotating mechanism and a rotating driving part, wherein the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, and the rotating driving part drives the rotating mechanism to rotate and then drives the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity.

The present disclosure relates to the technical field of solid waste recycling and fabricated buildings, and provides a solid waste large-mixing-amount concrete prefabricated laminated slab and a preparation method thereof. The solid waste large-mixing-amount concrete prefabricated laminated slab provided by the present disclosure comprises a prefabricated layer and a laminated layer. Transverse grooves and longitudinal grooves are formed in the surface of the prefabricated layer. During application, the grooves can be used for erecting pipelines, the contact area of the prefabricated layer and the laminated layer can also be increased, the combined effect of new concrete and old concrete is improved, the integrity of a floor slab is enhanced, and the effect of improving the overall stress capacity of the floor slab is achieved.

Solid waste large-mixing-amount concrete prefabricated laminated slab and preparation method thereof

Multi-solid waste activated concretes with high-silicon iron ore tailings and preparation methods thereof are disclosed. In at least some embodiments, the concrete is prepared from raw materials including 360-380 kg/mof a cement, 30-40 kg/mof fly ash, 30-40 kg/mof a modified ultrafine sand of high-silicon iron ore tailings, 930-950 kg/mof a waste stone of tailings, 870-930 kg/mof a fine sand of tailings, 160-170 kg/mof water, and 4-8 kg/mof an additive.

Multi-solid waste activated concrete with high-silicon iron ore tailings and preparation method thereof

Growing community of inventors

Shenyang, China

Hao Wang