Qualcomm Incorporated

Hao Su

Fatih Murat Porikli

Yinhao Zhu

Hong Cai

Minghua Liu

Systems and techniques are provided for part segmentation. For example, a process for performing part segmentation can include obtaining a three-dimensional capture of an object. The method can include generating one or more two-dimensional images of the object from the three-dimensional capture of the object. The method can further include processing the one or more two-dimensional images of the object to generate at least one two-dimensional bounding box associated with a part of the object. The method can include performing three-dimensional part segmentation of the part of the object based on a three-dimensional point cloud generated from the one or more two-dimensional images of the object and the at least one two-dimensional bounding box and based on semantically labeled super points which are merged into subgroups associated with the part of the object.

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La Jolla, CA, United States of America

Hao Su