Rambus Inc.

Apple Inc.

Hao Shi

Xingchao C Yuan

Jung-Hoon Chun

Meng Chi Lee

Gary S Thomason

Koussalya Balasubramanian

Mark J Beesley

Abhilash Rajagopal

Venus Kumar

Nima Shahidi

Quan Qi

Jason W Leung

Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

Systems and methods for manufacturing thin substrate

A data network may include a data bus and network nodes. The data bus may be a differential data bus having first and second differential signal lines that convey differential signals between the nodes. A bimodal impedance terminator may be coupled to the first and second differential signal lines at one or both ends of the data bus. The bimodal impedance terminator may include a first resistor coupled between the first differential signal line and a circuit node and a second resistor coupled between the second differential signal line and the circuit node. A capacitor may be coupled between the circuit node and ground. A third resistor may be coupled between the circuit node and ground in series with the capacitor. The bimodal impedance terminator may terminate both the differential-mode impedance and the common-mode impedance of the data bus to reduce signal reflections at the ends of the data bus.

Bimodal impedance matching terminators

In some embodiments, the semiconductor package includes a substrate having multiple layers, from a first layer to a final layer, a die coupled to the first layer, an electrical connector such as a solder ball coupled to the final layer, and a spiral trace disposed and electrically coupled between the die and the electrical connector. Inductance of the spiral trace is selected such that the package has a predetermined impedance. Material, cross-sectional area, number and density of windings, and total overall length of the spiral trace are selected accordingly. In other embodiments, the semiconductor package includes a substrate with multiple layers; a die coupled to the first of the layers; an electrical connector coupled to the final layer; and a spiral trace, in or on the substrate. The spiral trace is near the die, and electrically coupled between the die and the electrical connector.

Semiconductor package with embedded spiral inductor

The multilayer substrate includes a plurality of layers. Located within the plurality of layers are a number of vias. Conductive traces connect the vias to form trace/via paths having various topologies, geometries, and/or properties.

Multilayer flip-chip substrate interconnect layout

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Mountain View, CA, United States of America

Hao Shi