Nan Ya Plastics Corporation

Hao-Sheng Chen

Te-Chao Liao

Hung-Yi Chang

Dein-Run Fung

Wen-Cheng Yang

Chia-Lin Liu

Chih-Kai Chang

Ying-Te Huang

Chia-Yen Hsiao

Chien-Chih Lin

Jung-Jen Chuang

Zhang-Jian Huang

Chi-Lin Chen

Chun-Lai Chen

Yi-Cheng Li

Chuan Chou

Cheng-Li Chao

Yung-Sheng Wang

Chia-Cheng Chao

Jui-Jung Lin Lai

A rubber resin material with a high thermal conductivity and a high dielectric constant and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition, at least one first inorganic filler, and at least one second inorganic filler. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one first inorganic filler is selected from the group consisting of aluminum oxide, boron nitride, magnesium oxide, zinc oxide, aluminum nitride, silicon carbide, and aluminum silicate. The at least one second inorganic filler is selected from the group consisting of silica, strontium titanate, calcium titanate, and titanium dioxide.

Rubber resin material with high thermal conductivity and high dielectric constant and metal substrate using the same

A method for producing a polyester film is provided. The method includes a resin alloy master batch preparation step and a film forming step. The resin alloy master batch preparation step includes melting and kneading a high temperature resistant resin material and a polyester resin material with a twin-screw granulator, and then forming a plurality of resin alloy master batches. In the resin alloy master batch preparation step, a twin-screw temperature of the twin-screw granulator is between 250° C. and 320° C., and a twin-screw rotation speed of the twin-screw granulator is between 300 rpm and 800 rpm. The film forming step includes melting and extruding the resin alloy master batches with to form a polyester film. The polyester film includes a heat resistant layer formed of the plurality of resin alloy master batches so that the heat resistant layer includes the high temperature resistant resin material and the polyester resin material.

Method for producing a polyester film

A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

Fluoride-based resin prepreg and circuit substrate using the same

A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

Prepreg and metallic clad laminate

A flame-retardant polyester film and a method for manufacturing the same are provided. The flame-retardant polyester film includes a physically recycled polyester resin and a chemically recycled polyester resin. The physically recycled polyester resin is formed by a plurality of physically recycled polyester chips. The chemically recycled polyester resin is formed by a plurality of chemically recycled polyester chips and mixed with the physically recycled polyester resin. The plurality of chemically recycled polyester chips further includes chemically recycled electrostatic pinning polyester chips. The chemically recycled electrostatic pinning polyester chips contain electrostatic pinning additives, and the electrostatic pinning additives are metal salts. Expressed in percent by weight based on a total weight of the polyester film, a content of the electrostatic pinning additives in the polyester film is between 0.005% and 0.1% by weight. The flame-retardant polyester film further includes a flame-retardant additive.

Flame-retardant polyester film

A polyester film and a method for producing the same are provided. The polyester film includes a heat resistant layer. The heat resistant layer includes a high temperature resistant resin material and a polyester resin material. The high temperature resistant resin material and the polyester resin material are melted and kneaded with each other via a twin screw granulator. The twin-screw granulator has a twin-screw temperature between 250&#xb0; C. and 320&#xb0; C., and the twin-screw granulator has a twin-screw rotation speed between 300 rpm and 800 rpm, so that the high temperature resistant resin material is dispersed in the polyester resin material with a particle size of between 50 nm and 200 nm.

Polyester film and method for producing the same

A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with maleic anhydride, and has greater amounts of non-polar and hydrophobic groups in the molecular structure thereof.

Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board

A biaxially stretched polyester film and a method for producing the same are provided. The biaxially stretched polyester film includes a polyester resin base layer and a matte layer. The polyester resin base layer includes: (1) 50 to 95 wt % of a polyester resin base material, and an intrinsic viscosity of the polyester resin base material being between 0.5 and 0.8 dL/g; and (2) 0.01 to 5 wt % of a high viscosity polyester resin material, and an intrinsic viscosity of the high viscosity polyester resin material being between 0.9 and 1.1 dL/g. The matte layer includes: (1) 50 to 95 wt % of a polyester resin matrix material, and an intrinsic viscosity of the polyester resin matrix material being between 0.5 and 0.8 dL/g; and (2) 0.3 to 40 wt % of a plurality of filler particles, and the filler particles having an average particle size of between 0.15 &#x3bc;m and 10 &#x3bc;m.

Biaxially stretched polyester film and method for producing the same

A biaxially stretched polyester film and a method for producing the same are provided. The biaxially stretched polyester film includes a polyester resin base layer and a matte layer formed on the polyester resin base layer. The matte layer has a total weight of 100 wt %, and the matte layer includes: (1) 50 to 95 wt % of a polyester resin matrix, an intrinsic viscosity of the polyester resin matrix being between 0.5 and 0.8 dL/g; (2) 0.01 to 5 wt % of a high viscosity polyester resin, an intrinsic viscosity of the high viscosity polyester resin being between 0.9 and 1.1 dL/g; (3) 0.3 to 40 wt % of a plurality of filler particles, the filler particles having an average particle size of between 0.15 and 10 &#x3bc;m.

A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 &#x3bc;m to 1 &#x3bc;m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 &#x3bc;m and 100 &#x3bc;m.

Fluorine-containing substrate, copper clad laminate, and printed circuit board

A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.

Fluorocarbon prepreg and resin composition thereof

A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350&#xb0; C. to 250&#xb0; C. via a lowering temperature rate of 1 to 4&#xb0; C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

Fluorocarbon resin composition and prepreg and copper foil substrate using the same

A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210&#xb0; C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent curability.

Thermosetting resin composition

A process for producing a modified polyphenylene ether resin having a purity of more than 99.4%, comprising steps of graft modification, water rinse, and extraction as well as phase splitting, is disclosed that step of separating out powder during purification is no needed, and the solvent for use in performing dissolving of or/and extraction of polyphenylene ether resin can be recycled for future use, so that the manufacturing process is simple and uses less solvent as compared to the prior art, and further helps to conserve resources and is environmentally friendly.

Process for producing modified thermosetting polyphenylene ether resin

A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.

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Taipei, Taiwan

Hao-Sheng Chen