Huawei Technologies Co., Limited

Tencent Technology (shenzhen) Company Limited

Delta Electronics (shanghai) Co., Ltd

Huawei Digital Power Technologies Co., Ltd.

Nanjing Tech University

Hao Peng

Xiaojing Liao

Tao Yang

Wenjie Wang

Fangfang Xu

Zifu Hu

Ting Xu

Guoping Wu

Peng Li

Hong Tao Liu

Cheng Lu

Jie Zhou

Tianyu Gao

Zhaozheng Hou

Rui Li

Xiang Ling

Haibo Luo

Zedong Zeng

Zhiyuan Liu

Xu Han

Yankai Lin

Zimo Yang

Maosong Sun

Yu Yang

Hong Liu

This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer, a chip, a package body, and a connecting assembly. The package base layer has a first surface and a second surface that are opposite to each other. The chip is coupled to the first surface, and there is a chip pad on a surface that is of the chip and that is away from the package base layer. The package body covers the package base layer and the chip to protect the structure, and the chip pad is wired to a surface of the package body through the connecting assembly.

Package structure and package system

A power supply module includes a main body, a first solder pad, and a plurality of metal connection pillars. The main body has a first surface and a second surface. The main body includes a package body, a package base layer, and a power chip. The package base layer, the power chip, and the first solder pad are all disposed in the package body. The power chip is connected to the package base layer. An end of the power chip away from the package base layer is connected to the first solder pad. Each metal connection pillar has a first end connected to the first solder pad and a second end extending through the main body to an outer side of the first surface of the main body.

Power supply module and power device

This application discloses a chip package assembly, an electronic device, and a preparation method of a chip package assembly. The chip package assembly includes a package substrate, a chip, and a heat dissipation part. The package substrate includes an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer. The chip includes a front electrode and a back electrode that are disposed opposite each other, the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer. The heat dissipation part is connected to a surface of the upper conductive layer that is away from the chip. The upper conductive layer, the lower conductive layer, and the conductive part each conduct heat.

Chip package assembly, electronic device, and preparation method of chip package assembly

Disclosed is a text sentence processing method performed by a computer device, including: acquiring sample text sentences including entity pairs and relationship labels of the entity pairs; extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels, and performing positive-negative example sampling, to obtain a training set; inputting the training set into a relationship extraction model to generate loss values; and adjusting parameters of the relationship extraction model according to the loss values, and repeating the step of extracting positive and negative example sentence pairs from the sample text sentences according to the relationship labels to perform iterative training of the relationship extraction model until a training end condition is met, to obtain an updated relationship extraction model, the relationship extraction model being configured to identify an entity relationship of an entity pair in an input text sentence.

Text sentence processing method and apparatus, computer device, and storage medium

Vehicle dashboard

A video playing method and a terminal device and method including starting, by a terminal device, at least two playing instances based on an operation instruction of a user, where each of the at least two playing instances corresponds to a video display window, and where the video display window includes a first video display window and a second video display window, playing first channel content in the first video display window and playing second channel content in the second video display window according to a display mode selected by the user, detecting an operation gesture of the user on the first video display window or the second video display window, and adjusting playing modes of the first channel content and the second channel content according to the operation gesture of the user and a current display mode.

Video playing method and terminal device

A video playing method and a terminal device, the method including starting, by a terminal device, at least two playing instances based on an operation instruction of a user, where each of the at least two playing instances corresponds to a video display window, and where the video display window comprises a first video display window and a second video display window, playing first channel content in the first video display window and playing second channel content in the second video display window according to a display mode selected by the user, detecting an operation gesture of the user on the first video display window or the second video display window, and adjusting playing modes of the first channel content and the second channel content according to the operation gesture of the user and a current display mode.

A counter-flow fin plate heat exchanger for gas-to-gas heat exchange includes several outer channel fins, an outer channel bending plate, an inner channel fin and an inner channel bending plate. The outer channel bending plate is a flat plate with two sides bending upward vertically. The inner channel bending plate is a cuboid box without a cap on the top, and the top of the inner channel bending plate is hermetically fixed with the bottom of the outer channel bending plate. The several outer channel fins are arranged in parallel inside the outer channel bending plate. The inner channel fins are arranged inside the inner channel bending plate. Ends of a side surface corresponding to two long sides of the inner channel bending plate are respectively provided with an opening, and the two openings are respectively disposed at different ends of the two side surfaces.

Counter-flow fin plate heat exchanger for gas-gas heat exchange

The present invention relates to a control method for balancing a neutral point voltage of a three-level circuit, comprising obtaining the neutral point voltage through sampling, adjusting a duty ratio of a zero level in one phase to maintain balance of the neutral point voltage when an absolute value of the neutral point voltage is larger than a threshold value, and distributing duty ratios of positive and negative levels in the phase, such that an output voltage of switch bridge arm in the phase includes positive, negative and zero levels in at least one switch period. The present invention can be carried out in a three-phase four-wire system and a three-phase three-wire system. In the three-phase three-wire system, it may also be combined with zero sequence voltage injection to form a mixed modulation method, thereby acquiring more effective neutral point balance control performance, and reducing switch loss.

Three-level circuit and control method for balancing neutral point voltage of the same

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Nanjing, China

Hao Peng