United Microelectronics Corp.

Hao-Ming Lee

Sheng-Hao Lin

Huai-Tzu Chiang

Hsin-Yu Chen

Chien-Hung Chen

Chun-Yuan Wu

Yu-Ru Yang

Shih-Hsien Huang

Cheng-Tzung Tsai

Shou-Wei Hsieh

Tzyy-Ming Cheng

Tsai-Fu Chen

Ta Kang Lo

A high electron mobility transistor (HEMT) device including a substrate, a channel layer, a barrier layer, a p-type gallium nitride (GaN) spacer, a gate electrode, a source electrode, and a drain electrode is provided. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer and has a protruding portion. The P-type GaN spacer is disposed on a side wall of the protruding portion. The gate electrode is disposed on the protruding portion and the P-type GaN spacer. The source electrode and the drain electrode are disposed on two sides of the gate electrode.

High electron mobility transistor device having a barrier layer with a protruding portion

Provided is a FinFET including a substrate, at least one fin and at least one gate. A portion of the at least one fin is embedded in the substrate. The at least one fin includes, from bottom to top, a seed layer, a stress relaxation layer and a channel layer. The at least one gate is across the at least one fin. A method of forming a FinFET is further provided.

Fin-type field effect transistor and method of forming the same

A semiconductor device and a method of forming the same, the semiconductor device includes a single crystal substrate, a source/drain structure and a nanowire structure. The source/drain structure is disposed on and contacts with the substrate. The nanowire structure is connected to the source/drain structure.

Semiconductor device with single-crystal nanowire FinFET

A method for fabricating semiconductor device includes the steps of first forming a metal gate on a substrate and a spacer around the metal gate, in which the metal gate comprises a high-k dielectric layer, a work function metal layer, and a low-resistance metal layer. Next, part of the high-k dielectric layer is removed to form an air gap between the work function metal layer and the spacer.

Method for fabricating semiconductor device

A semiconductor device comprises a semiconductor substrate and a semiconductor fin. The semiconductor substrate has an upper surface and a recess extending downwards into the semiconductor substrate from the upper surface. The semiconductor fin is disposed in the recess and extends upwards beyond the upper surface, wherein the semiconductor fin is directly in contact with semiconductor substrate, so as to form at least one semiconductor hetero-interface on a sidewall of the recess.

Semiconductor device and method for fabricating the same

A method of fabricating an embedded nonvolatile memory device is disclosed. A semiconductor substrate having thereon a fin body protruding from an isolation layer is provided. A charge storage layer crossing the fin body is formed. An inter-layer dielectric layer is deposited on the semiconductor substrate. The inter-layer dielectric layer is polished to expose a top surface of the charge storage layer. The charge storage layer is then recess etched and cut into separate charge storage structures. A high-k dielectric layer is formed on the charge storage structures. A word line is formed on the high-k dielectric layer.

Method of fabricating an embedded nonvolatile memory device

Method of forming a single-crystal nanowire finFET

The present invention provides some methods for forming at least two different nanowire structures with different diameters on one substrate. Since the diameter of the nanowire structure will influence the threshold voltage (Vt) and the drive currents of a nanowire field effect transistor, in this invention, at least two nanowire structures with different diameters can be formed on one substrate. Therefore, in the following steps, these nanowire structures can be applied in different nanowire field effect transistors with different Vt and drive currents. This way, the flexibility of the nanowire field effect transistors can be improved.

Method for forming semiconductor structure

The present invention provides a method for forming a semiconductor structure, at least including the following steps: first, four sacrificial patterns are formed on a substrate, and a plurality of spacers are then formed surrounding each sacrificial pattern. Next, the four sacrificial patterns are removed, and a photoresist layer is formed between each spacer, covering parts of each spacer. Afterwards, a first etching process is performed to partially remove each spacer, and the photoresist layer is then removed, and a second etching process is then performed, to remove each spacer again, and to form four nanowire hard masks.

A method for fabricating semiconductor device includes the steps of: providing a substrate having at least one fin-shaped structure thereon, wherein the fin-shaped structure comprises a top portion and a bottom portion; removing part of the bottom portion of the fin-shaped structure; forming an epitaxial layer on the substrate to surround the bottom portion of the fin-shaped structure; transforming the bottom portion of the fin-shaped structure into the epitaxial layer; and removing part of the epitaxial layer.

A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having at least one fin-shaped structure thereon, wherein the fin-shaped structure comprises a top portion and a bottom portion; removing part of the bottom portion of the fin-shaped structure; forming an epitaxial layer on the substrate to surround the bottom portion of the fin-shaped structure; transforming the bottom portion of the fin-shaped structure into the epitaxial layer; and removing part of the epitaxial layer.

A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a fin-shaped structure thereon and a shallow trench isolation (STI) around the fin-shaped structure, wherein the fin-shaped structure comprises a top portion and a bottom portion; removing part of the STI to expose the top portion of the fin-shaped structure; and performing an oxidation process on the exposed top portion of the fin-shaped structure to divide the top portion into a first top portion and a second top portion while forming an oxide layer around the first top portion.

Growing community of inventors

Taichung, Taiwan

Hao-Ming Lee