United Test and Assembly Center Limited

Nanyang Technological University

Hao Liu

Chin Hock Toh

Ravi Kanth Kolan

Yi Sheng Anthony Sun

Rahamat Bidin

Hien Boon Tan

Anthony Yi Sheng Sun

Chuen Khiang Wang

Alessandro Romagnoli

Srithar Rajoo

Clifton Teik Lyk Law

Ricardo Fernando Martinez-Botas Mateo

A turbine housing for a radial/mixed flow turbine, the turbine having a rotor comprising a plurality of blades disposed about a hub, the turbine housing comprising: a shroud configured to at least partially enshroud the rotor wherein a clearance is provided between the shroud and blade tips of the plurality of blades, the shroud and the hub defining a main passage of fluid flow in the turbine; and at least one injection opening provided in the shroud, the at least one injection opening configured to allow injection of a secondary flow of fluid into at least the clearance between the shroud and the blade tips.

Turbine housing and method of improving efficiency of a radial/mixed flow turbine

A method for preparing a die for packaging is disclosed. A die having first and second major surfaces is provided. Vias and a mask layer are formed on the first major surface of the die. The mask includes mask openings that expose the vias. The mask openings are filled with a conductive material. The method includes reflowing to at least partially fill the vias and contact openings to form via contacts in the vias and surface contacts in the mask openings.

Through silicon via dies and packages

A SIM card is presented. The SIM card includes a support carrier having a first and a second major surface. The support carrier includes a cavity which extends partially into the carrier from the first major surface. The SIM card further includes a chip package disposed within the cavity. The support carrier is sufficiently flexible to bend when the SIM card is being inserted into or removed from a SIM card holder.

Subscriber identity module (SIM) card

A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.

Vented die and package

A chip package includes a carrier having a first and a second major surface. The first major surface includes an active region surrounded by an inactive region. The chip package includes contact pads in the active region for mating with chip contacts of a chip. A support structure is disposed on the inactive region of the first major surface. The support structure forms a dam that surrounds the active region. When a chip or chip stack is mounted in the active region, spacing exists between the dam and the chip or chip stack. The spacing creates convention paths for heat dissipation.

Mold design and semiconductor package

A method for of manufacturing integrated circuit packages and a multi-chip integrated circuit package are disclosed. According to the method, a first die is attached onto a first side of a set of leads of a leadframe, and an adhesive is applied onto the set of leads at a second side opposite to the first side. A second die is attached onto the adhesive. The adhesive fills into the gaps defined by the set of leads. The adhesive is thereafter cured. In a multi-chip integrated circuit package made according to the method, the adhesive attaching the second die fills the gaps between the leads so that to avoid formation of internal cavities of the package.

Growing community of inventors

Singapore, Singapore

Hao Liu