Advanced Optoelectronic Technology, Inc.

Hao-Hsiang Hsieh

Shih-Hsiang Lo

Hsin-Ting Hung

Chuang-Yu Hsieh

The present disclosure provides an optical packaging structure and a backlight module with the optical packaging structure. The optical packaging structure includes a light-emitting chip, a packaging layer, a fluorescent layer, a lens structure, and a reflecting layer. The light-emitting chip includes a light-emitting surface, a connecting surface, and a side surface. The packaging layer covers the light-emitting surface and the first side surface. The connecting surface is exposed from the packaging layer. The fluorescent layer is disposed on the packaging layer, and covers on the light-emitting surface and the first side surface. The lens structure is disposed on a top surface of the fluorescent layer. A surface of the lens structure is recessed towards the light-emitting chip to form a curved surface. The reflecting layer is disposed on the curved surface.

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Hsinchu, Taiwan

Hao-Hsiang Hsieh