Wistron Corporation

Hao-Chun Hsieh

Chia-Hsien Lee

Hsin-Lun Tsai

Pi-Chiang Huang

Chang-Lung Chen

Jun-Min Yang

Sheng-Wen Cheng

Hsien-Min Chen

Kaun-Chang Wu

A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.

Temperature measuring board device and temperature measuring board thereof

A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided.

Process apparatus capable of pushing panel-shaped object and process method thereof

The disclosure provides a feeder system, for providing multiple materials from a tube, including a transportation platform and a material guiding carrier. The material guiding carrier is mounted on the transportation platform. The material guiding carrier includes a material input portion and a material output portion. A material output opening of the tube is located at the material input portion. The materials from the tube are conveyed to the material guiding carrier by the transportation platform. At least two guiding members are mounted on the material guiding carrier for matching the tube in an adjustable manner to guide the materials from the material input portion to the material output portion along a material feeding direction. The material feeding direction and an arrangement of the at least two guiding members are parallel to each other.

Feeder system and material guiding carrier thereof

A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Soldering system of soldering a dip component on a circuit board

A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.

Method and soldering system of soldering a DIP component on a circuit board

A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

Method for assembling components on a circuit board

A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.

Clamping tool and equipment for rework process

A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.

Metal shielding can and assembly of the metal shielding can and a circuit board

A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.

System for assembling components on a circuit board

A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board.

Growing community of inventors

Taipei, Taiwan

Hao-Chun Hsieh