Samsung Electronics Co., Ltd.

HanShin Youn

Woojae Kim

YoungHoon Ro

Sungwoo Park

Yunseok Choi

Yonghwan Kwon

Yechung Chung

In Won O

Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.

Semiconductor packages

An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

Package for semiconductor device including guide rings and manufacturing method of the same

Growing community of inventors

Hwaseong-si, South Korea

HanShin Youn