Nxp B.v.

Hans Van Zadelhoff

Greja Johanna Adriana Maria Verheijden

Bart Van Velzen

A method of manufacturing a MEMS device comprises forming a MEMS device element (). A sidewall () is formed around the MEMS device element, and a sacrificial layer () is formed over the device element and within the sidewall. A package cover layer () is provided over the sacrificial layer, and the sacrificial layer is removed. This method provides additional sidewalls to the cap provided over the MEMS device. These additional sidewalls can then be deposited by a different process and be formed of a different material to the top part of the package cover layer. The sidewalls can prevent reflow of the sacrificial layer and improve the sealing properties of the sidewalls.

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Andelst, Netherlands

Hans Van Zadelhoff