Siemens Aktiengesellschaft

Hans Stelzl

Heiner Bayer

Wolfgang Pahl

Michael Rogalli

Winfried Plundrich

Walter Fischer

Ernst Schmotz

Frank Dittrich

Method of producing an attenuating structure on a surface wave component

An acoustically matched reaction resin compound for damping coating of surface wave components is disclosed that contains one or more epoxy resins, one or more dicarboxylic acids or polycarboxylic acids or, respectively, acidic esters of dicarboxylic acids or polycarboxylic acids, an aliphatic or hetero-aromatic amine in a proportion sufficient to catalyze the cross linking of the reaction resin compound, and a solvent. The number of amine hydrogen equivalents and acid equivalents together is less than the number of epoxy equivalents and the uniformly mixed reaction resin compound can be set to a predetermined viscosity and thixotropy required for the application. For example, the reaction resin compound can be applied onto the wafer containing the surface wave components in a silk screening process. Sharp contours can be produced that survive the curing process in an unmodified state. The damping properties of cured reaction resin structures are excellent; corrosion induced by the resin is noticeably reduced.

Surface wave components with an acoustically matched damping compound

A casing for electrical components, component assemblies or integrated circuits, and particularly for electrical surface-wave filters, is disclosed as well as a method of production therefor where the electrically active element rests on a base strip from which project outgoing connectors through the casing walls. The connectors provide mechanical and electrical connection to printed circuit boards. A thermosetting-plastic trough adheres closely to the underside of the base strip, while the side-wall reels of the trough rest on the borders of the upper surface of the base strip. Over the trough is placed a thermosetting-plastic lid so that the active element is contained in an enclosure. The trough-and-lid assembly is then coatable in thermosetting plastic.

Casing for electrical components, component assemblies or integrated

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Vaterstetten, Germany

Hans Stelzl