Siemens Aktiengesellschaft

Hans Rappl

Kurt Gross

Michael Kirchberger

Stefan Kulig

Volker Karrer

Gerd Auerswald

Gunter Ludwig

An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate () and the support plate () by providing a hole (), into which an electrically conducting bonding element () with a bondable surface () is pressed in such a way that the support plate () and the bonding element () enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element ().

Electrically conducting bonding connection

The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

Circuit arrangement

A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 &#x3bc;m and 10 &#x3bc;m, is arranged on the metal area. The chip does not have a chip housing and is arranged on the metal area, which has been provided with the buffer layer, such that only one connecting medium is arranged between the rear side metallization layer of the chip and the buffer layer.

Carrier with a metal area and at least one chip configured on the metal area

A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

Growing community of inventors

Nittendorf, Germany

Hans Rappl