Robert Boschgmbh

Hans-Peter Trah

Franz Laermer

Jiri Marek

Juergen Buchholz

Martin Maier

Joerg Muchow

Kurt Weiblen

Thorsten Pannek

Guenther Findler

Udo Jauernig

Frank Fischer

Hubert Benzel

Stefan Pinter

Hans Artmann

Andrea Schilp

Gottfried Flik

Jochen Franz

Christian Doering

Armin Schuelke

Helmut Baumann

Michael Mettner

Matthias Illing

Frank Bantien

Oliver Schatz

Andreas Duell

Harald Emmerich

Lars Metzger

Steffen Schmidt

Martin Willmann

Kurt Ingrisch

Karl Bender

Thomas Grauer

Franz Riedinger

Wolfgang Klucken

Botho Ziegenbein

A structural element having a region of porous silicon or porous silicon oxide, which was obtained from a porization, starting from an edge area of the region, in at least largely crystalline silicon. Relative to the edge area, the crystalline silicon has a crystal orientation that has an orientation that differs from a &#x3c;100&#x3e; orientation or from an orientation that is equivalent for reasons of symmetry. This structural element is suited for use in a mass-flow sensor, in a component for the thermal decoupling of sensor and/or actuator structures, or a gas sensor. Furthermore, methods for setting the thermal conductivity of a region of porous silicon or porous silicon oxide of a structural element are described. In particular, in a porization of crystalline silicon, starting from an edge area of the region, the crystalline orientation of the silicon relative to the edge area is selected such that a thermal conductivity comes about along a direction perpendicular to the edge area that differs from, in particular is lower than, the thermal conductivity, that comes about in this direction in an otherwise analogous porization of crystalline silicon having a &#x3c;100&#x3e; orientation or an equivalent orientation relative to this edge area.

Structural element having a porous region at least regionally provided with a cover layer and its use as well as method for setting the thermal conductivity of a porous region

A device for manufacturing a capacitive pressure measurement includes an insulated base electrode, a mechanically deflectable counterelectrode composed of a layer made of at least one of a monocrystalline and polycrystalline semiconductor material, a contact arrangement for electrically connecting the electrodes, and at least one semiconductor component, all integrated onto a semiconductor substrate. The connection for the base electrode is formed by an electrically insulated conductive polycrystalline semiconductor layer. The method for manufactured the device includes the step of arranging a conductive polycrystalline semiconductor layer between two insulating layers on the semiconductor substrate for forming a base electrode.

Device for capacitive pressure measurement and method for manufacturing a capacitive pressure measuring device

An apparatus for supplying energy to a sensor co-moved with a wheel of a vehicle, which contains a generator co-moved with the wheel of the vehicle, the generator generating electrical energy from vibrational motions of the vehicle.

Method and apparatus for supplying energy to sensors

A micropatterned thermosensor, e.g., an infrared sensor, includes a supporting body and at least one thermocouple arranged thereon. The thermocouple also has a first material and a second material, which together form, at least in a pointwise manner, at least one thermal contact. Furthermore, it is provided that the first and/or the second material are configured at least regionally in the form of a meander-shaped or undulating-type circuit trace and extend on the supporting body. In addition, a micropatterned thermosensor having such patterned circuit traces, in which the first material is platinum or aluminum, and the second material is doped or undoped polysilicon-germanium.

Microstructured thermosensor

A micromechanical cap structure and a corresponding manufacturing method are described, the cap structure having a substrate, in particular in the form of a wafer, having a cavity made therein. The cavity includes a bottom surface and two pairs of opposite parallel side wall sections. The cavity has at least one stabilizing wall section, which connects two side wall sections. This considerably increases the stability of the cap structure.

Micromechanical cap structure and the respective manufacturing method

Pressure sensor

In a method of producing micromechanical structures on semiconductor components, in particular on the surface of a wafer containing integrated circuits, provision is made for the micromechanical structures to be provided subsequently on a fully processed semiconductor component using process steps which are normally applied in semiconductor component production and are at most slightly modified, but independently of the semiconductor component production process.

Method of producing micromechanical structures

A valve for injecting a fuel/gas mixture that includes a perforated body, which comprises an upper thin plate and a lower thin plate, both of which are for instance embodied of monocrystalline silicon. At least one conduit is formed between the upper thin plate and the lower thin plate, by way of which conduit the gas meets the fuel injected through the at least one injection port. It is unnecessary to adjust the metered gas quantity. The perforated body and the valve are particularly suitable for injection systems in mixture-compressing internal combustion engines with externally supplied ignition.

Perforated body and valve with perforated body

In a micropump having a working chamber (1), an intake valve (2), and a discharge valve (3), the valves (2,3) are etched out of silicon wafers (4,5). The gas in the working chamber (1) is heated by a heating element (6), so that an overpressure is produced in the working chamber. A partial vacuum is created by cooling the gas in the working chamber (1). The pump action of the micropump is achieved through the succession of overpressure and partial-vacuum cycles.

Thermal micropump with values formed from silicon plates

A micro-actuator includes force elements and compensation elements arranged on a bending element such that a change in the environmental temperature does not cause any flexing of the bending element.

Micro-actuator

Process for producing micro-mechanical structures

A method for anisotropically etching recesses in a monocrystalline disk-shaped wafer is proposed, by which structural elements such as membranes or through openings can be made in the wafer. To this end, a mask layer is applied to a first surface of the wafer and subsequently structured by making at least one opening in the mask layer. The dimensioning of the at least one opening, and its orientation with respect to the crystal orientation of the wafer and to the anisotropic properties of the wafer material, are selected such that the desired size and shape of the area of the recess or outlet hole are attained by anisotropic etching into the wafer through the at least one opening in the mask layer and by purposeful underetching of the mask layer.

Method of anisotropically etching monocrystalline, disk-shaped wafers

A valve for metering a fluid including a small upper plate, a small middle plate and a small lower plate. The small middle plate has a closing element with a diaphragm region surrounding the closing element. The stroke of the closing element is limited in an axial direction by the small upper plate and by a valve seat of the small lower plate. As a result, very accurate metering of the fluid is possible. The valve is especially suitable as an injection valve for injection systems of mixture-compressing internal combustion engines with externally supplied ignition.

Valve

A method of making micromechanical structures from silicon involves cutting a monocrystalline silicon wafer. The orientation of the crystal structure relative to the flat of the wafer is first determined, and this information is taken into account in the subsequent structuring steps.

Method of making micromechanical components

A fuel injection valve including a perforated silicon plate disposed downstream of a valve seat and having an atomization opening that widens in the flow direction. The perforated silicon plate has at least one elongated recess on an upper end face oriented toward the valve seat face; this recess at least partly overlaps a metering opening extending as far as a lower face end of the perforated plate. The perforated plate makes it possible to form flat streams, so that very fine atomization of the injected fuel is attained. Forming the elongated recesses and atomization openings by etching makes high-precision manufacture possible at low production cost. The perforated plate and fuel injection valve are especially suitable for injection systems of mixture-compressing internal combustion engines with externally supplied ignition.

Growing community of inventors

Reutlingen, Germany

Hans-Peter Trah