Siemens Aktiengesellschaft

First Sensor Technology Gmbh

Hans-Peter Landgraf

Johannes Ante

Markus Gilch

Andreas Ott

Henderikus-L Offereins

Christian Geiger

A pressure sensor device is described that has a diaphragm acted upon by a working medium, on a first side, and a sensor chip, which is disposed on a second side of the diaphragm that is remote from the working medium. There is formed in the sensor chip a measuring bridge having four sensor elements, which form two pairs disposed parallel, and the pairs are disposed at right angles to one another. The sensor elements are disposed such that they are closely spaced apart from one another in the edge region of the sensor chip that faces toward the central point of the diaphragm.

Pressure sensor device

A disk-shaped silicon sensor element for a pressure sensor is described. The sensor element has a disk upper side, a disk underside, stress measuring elements that convert mechanical stresses into signals, and circuits disposed on the disk upper side. The disk underside serves during a pressure measurement for receiving a force that acts as a bending pressure for bending the disk-shaped silicon sensor element. The sensor element is formed with essentially the same thickness over its entire extent.

Disk-shaped silicon sensor element for a pressure sensor and pressure sensor using such a silicon sensor element

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Wuppertal, Germany

Hans-Peter Landgraf