Robert Boschgmbh

Hans-Martin Hochenberger

Winfried Kuhnt

Werner Herden

Erich Zabler

Heiko Gruner

Werner Pfander

Hans Neu

Thomas Fessele

Karl-Otto Linn

Claus-Dietrich Pilch

Hans-Joachim Seidel

A device for measuring pressure includes a housingin which a carrierequipped with a sensor elementand electrical connection elementsis located. The housingis made up of a first housing chamberthat encloses the sensor elementand is connected with a first pressure channelof a first pressure connection. The housing also includes a second housing chamberthat is sealed off from the first housing chamberand encloses at least the electrical connection elements. The housinghas a third housing chamberthat is sealed off from the first housing chamberand the second housing chamber. The third housing chamber is connected with a second pressure channelof a second pressure connection

Pressure measuring device

A pressure sensor that is mounted on an intake tube of an internal combustion engine which prevents icing of the pressure connection. The pressure sensor of the invention has a stublike pressure connection, which extends from an inner wall of an intake tube to approximately the middle of the intake tube or beyond the middle, and as a result the risk of icing of the pressure sensor is considerably reduced. A pressure sensor is intended especially for mixture-compressing internal combustion engines with externally supplied ignition.

Pressure sensor for an internal combustion engine having an intake tube

A meander-shaped layer of nickel is deposited by evaporation on a ceramic wafer over an intermediate layer of tantalum serving to improve adhesion, and covered by a protective coating of silicon or epoxy resin is used as a temperature sensor in the intake pipe of a supercharged internal combustion engine. The low mass of the sensor element thus provided enables the resistance of the nickel path to follow rapidly, by its variation, the variations of temperature of the intake air. The sensor has a casing made up of two parts, the lower one of which has two connection prongs molded into it, the ends of which are flattened into tabs that are soldered to contact areas of the ceramic wafer. The upper casing portion has a cavity for the ceramic wafer, the lower part of which is filled with a potting compound to protect the solder joints. The width of the nickel paths that provide the temperature sensitive resistance is about 50 .mu.m and the thickness is from 0.2 to 1 .mu.m and the resistance may be typically 1000 ohms.

Rapid acting gas temperature sensor

Growing community of inventors

Schwieberdingen, Germany

Hans-Martin Hochenberger