Tyco Electronics Services Gmbh

Zarlink Semiconductor Limited

Tyco Electronics Svenska Holdings Ab

Hans Magnus Emil Andersson

Odd Steijer

Asa Christina Johansson

John Krister Frode

An interposer comprising a substrate having at least a top surface and a bottom surface, the top and bottom surfaces being substantially parallel; at least one series of bottom cavities on the bottom surface; at least one expansion cavity contiguous with the at least one series of bottom cavities, the at least one expansion cavity being larger than each of the bottom cavities; a perimeter defined on the bottom surface around the bottom cavities; at least one alignment fiducial on the top surface for cooperating with a corresponding fiducial on the detachable optical interface to optically couple an optical conduit attached to the detachable optical interface with at least one optical device; and the at least one optical device mounted to the substrate on at least a portion of the perimeter, the optical device configured to emit a diverging light beam or receive a non-diverging light beam.

Interposer with opaque substrate

Disclosed is an optical floating sub-assembly, comprising a thermally conductive non rigid substance between the heat sink carrier and external casing, to minimize mechanical stress on the optical assembly. Also disclosed is a printed circuit board as an electrical interface, comprising two modules capable of converting an electrical signal to an optical signal, transmitting the optical signal and then converting the optical signal back to an electrical signal. Also disclosed is an optical assembly, comprising a heat sink with mechanical features for optical alignment.

Fiber optic cable assembly for optical transceiver

Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy. Preferably, the optical dies have a polymer mass to assist the heat transfer to the silicon substrate.

Self-aligned silicon carrier for optical device supporting wafer scale methods

Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.

Self-aligned carrier assembly for optical device supporting wafer scale methods

An optic fiber connection arrangement has a module mountable on a printed circuit board, and an optic fiber coupler including mating components. One of the mating components is adapted for coupling into the module. A frame supports one of the components. The frame is releasably latchable to the module so as to couple and decouple the mating component to the module. In this way, the optic fiber coupler can be removed from the module by releasing the frame. The other mating component can be removed from the one mating component after removal of the frame from the module.

Growing community of inventors

Järfälla, Sweden

Hans Magnus Emil Andersson