Siemens Aktiengesellschaft

Epcos Ag

Snaptrack Incorporated

Siemens Aktiengesellschaft & Balzers Aktiengesellschaft

Epcos Ac

Seimans Aktiengesellschaft

Hans Krueger

Wolfgang Welsch

Alois Stelzl

Wolfgang Pahl

Christian Bauer

Klemens Huebner

Gregor Feiertag

Anton Leidl

Manfred Kobale

Waldemar Greubel

Guenter Baur

Hubert Weber

Juergen Portmann

Rudolf Haeusler

Alois Schauer

Hans Golser

Stefan Seitz

By Thekla Lamprecht, Heir

Herbert Lamprecht, Deceased

By Simon Lamprecht, Heir

Werner Ruile

Karlheinz Arndt

Hinrich Heynisch

Jürgen Portmann

Heinz Pape

Peter Mammach

Karl-Heinz Walter

Alexander Schmajew

Hans-Peter Lorenz

Wilhelm Tiemann

Karl Nicolaus

Werner Cirkler

Peter Demmer

Guenther Hahn

Herbert Lamprecht

Werner Seiffarth

Ernst Christl

Peter Geschka

Walter Kirschner

Christian Hoffmann

Hans F Mahlein

Ferdinand Quella

Robert Koch

Wolfgang Guenther

Peter Selmeier

Hans Pink

Walter Rauscher

Norbert Wenzel

Martin Bechteler

Erwin Hubner

Wilfried Haas

Walter Geffcken

Hubert Grosse-Wilde

Volker Wittwer

Klemens Hubner

Hans Rehme

Horst Seunik

Robert Hammedinger

Michael Schulz

Werner Glaubitz

Guenter Funk

Hans P Good

Helmut Fritzsche

Guenter Kellerer

Klemens Huener

Joerg Moehnle

Michael Gerner

Rudolf Knauer

Guenther Baur

Fritz Windscheid

Hans Kohlmueller

A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

Wafer-level package and method for production thereof

A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.

Component and method for producing a component

A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.

Method for connecting a plurality of unpackaged substrates

A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.

Method and apparatus for producing chip devices, and chip device produced by means of the method

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Miniaturized electrical component comprising an MEMS and an ASIC and production method

A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

Circuit board with flexible region and method for production thereof

The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S) is closed; and a second sound inlet opening (S) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S) is prepared but closed.

MEMS microphone and method for producing the MEMS microphone

Frames () applied on a wafer () are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (), in particular for filter or MEMS structures. Inner columns () can be provided for supporting the housing and for the ground connection; outer columns () can be provided for the electrical connection and are connected to the component structures by means of conductor tracks () that are electrically insulated from the frames ().

Hermetically sealed housing for electronic components and manufacturing method

A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.

Element with optical marking, manufacturing method, and use

On a carrier () an adhesion layer (), an ASIC chip () and a sensor chip () are arranged one above another. An interchip connection () is provided for electrically connecting the chips among one another, and an ASIC connection () is provided for externally electrically connecting the circuit integrated in the ASIC chip.

Semiconductor chip arrangement with sensor chip and manufacturing method

A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

MEMS package and method for the production thereof

A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.

Method for producing a MEMS package

A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

MEMS component and method for production

A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

Component with reduced temperature response, and method for production

Growing community of inventors

Munich, Germany

Hans Krueger