Epcos Ag

Siemens Aktiengesellschaft

Siemens Matsushita Components Gmbh & Co Kg

Hans Kr&uuml;ger

Alois Stelzl

Wolfgang Pahl

Karl Weidner

Manfred Wossler

An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.

Surface acoustic wave component

The multiple blank can be diced into individual blanks for electronic components, in particular surface acoustic wave components. Each of the individual blanks is suitable for contact to be made with chips in the flip-chip technique and for contact to be made with the individual blanks in the SMD technique, using external connections. The multiple blank has, for each individual blank, metalized areas which are located on a network which is integrated between layers of the multiple blank and leads to a connecting terminal. Bumps are built up by depositing metal by electroplating on the metalized areas.

Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the like

A SAW component has a component system that is mounted on a base plate such that it makes electrical contact with the base plate. A protective coating is provided on a component side of the component system that faces away from a connecting region between the component system and the base plate. The protective coating forms a seal, which is proof against environmental influences, for the component system toward the base plate.

Electronic component, in particular a component operating with surface acoustic waves

A method for producing an electronic component includes placing an enclosed frame on a baseplate. A chip is provided to be fitted within the frame, forming a first given space between the chip and the baseplate and forming a second given space between the chip and the frame. The first given space is enclosed in a hermetically sealed manner by pressing a film onto the chip, except on a surface of the chip facing the baseplate, such that the film surrounds the chip and at least reaches the surface of the baseplate. The second given space is filled with a casting compound. The film is then removed at surface regions of the film being free of the casting compound. Finally, a cover composed of an electrically conductive material is applied on the chip, the casting compound and the frame.

Method for producing an electronic component

A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.

Method of producing a surface acoustic wave component

The SAW component has electrical structures which are encapsulated and sealed against environmental influences by a cap cover. Connecting pads of the electrical structures are exposed in a window of the cap cover and the pads are provided with a metallization. Solderable metallized areas are formed on the cap cover, and they are connected to the pad metallizations via through-plated holes.

Electronic component in particular an saw component operating with surface acoustic waves and a method for its production

The SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which may be reinforced with current-less or galvanic deposition.

Growing community of inventors

München, Germany

Hans Krüger

Growing community of inventors

München, Germany

Hans Kr&uuml;ger

Hans Krüger