Epcos Ag

Snaptrack Incorporated

Hans Krüger

Alois Stelzl

Gregor Feiertag

Wolfgang Pahl

Christian Bauer

Jürgen Portmann

Alexander Schmajew

Ernst Christi

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

MEMS component and method for encapsulating MEMS components

The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.

Encapsulation of an MEMS component and a method for producing said component

An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure.

MEMS package and method for the production thereof

A component includes a first substrate having a first front side for holding first component structures, and a second substrate having a second front side for holding second component structures. The first and second substrates are connected together electrically and mechanically. The first and second front sides face each other. The first and second component structures include SAW structures, FBAR structures, MEMS sensors or switches, or MEOPS components, or combinations thereof.

Electrical component and production method

A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which is mounted on at least one side of the glass film. The component is covered and sealed by a cover layer mounted on the carrier substrate.

Component arrangement provided with a carrier substrate

An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.

Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method

An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.

Method for encapsulating an electrical component

For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition.

Substrate for an electric component and method for the production thereof

For labeling a component provided with a metallic cover layer, it is proposed that at least one additional contrast layer is arranged over the cover layer. The contrast layer produces an optical contrast with the metallic cover layer and is capable of being eroded by a laser for producing a label.

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Munich, Germany

Hans Krüger