Atotech Deutschland Gmbh

Hans-Jürgen Schreier

Hartmut Mahlkow

Rohan N Akolkar

Lutz Stamp

Lutz Brandt

Jens Wegricht

Gerhard Steinberger

Matthias Dammasch

Thomas Thomas

Isabel-Roda Hirsekorn

Marco Haryono

Sengül Karasahin

Jacob Blickensderfer

Paige Altemare

Kay-Oliver Thiel

Kilian Arnd

Jana Nauman

The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.

Method for depositing a copper seed layer onto a barrier layer and copper plating bath

A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

Adhesion promoting agents for metallization of substrate surfaces

An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.

Iron boron alloy coatings and a process for their preparation

The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of silver in the second method step when the first metal is silver.

Immersion plating of silver

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Velten, Germany

Hans-Jürgen Schreier