Other

Henkel Ag & Company, Kgaa

Heraeus Deutschland Gmbh & Co Kg

Alpha Metals, Inc.

Hans-Jürgen Albrecht

Klaus Wilke

Klaus Müller

Gunnar Petzold

Werner Kruppa

Hector Andrew Hamilton Steen

Mathias Nowottnick

Klaus Heinrich Georg Bartl

Klaus Wittke

The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.

Soldering material based on Sn Ag and Cu

Growing community of inventors

Berlin, Germany

Hans-Jürgen Albrecht