Infineon Technologies Ag

Siemens Aktiengesellschaft

Nokia Corporation

Hans-Jörg Timme

Robert Aigner

Stephan Marksteiner

Pasi Tikka

Juha Ellä

Peter Pfann

Thomas Bever

Stefan Helmut Schmalzl

Andreas Bogner

Juha Ellae

Annette S&auml;nger

Lüder Elbrecht

Katri Helena Pohjonen

L&uuml;der Elbrecht

Rüdiger Bauder

A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.

Filter device and method for fabricating filter devices

A filter circuit comprises a balanced port, an unbalanced port and a substrate. A series circuit of a filter stage and a balun is disposed between the balanced port and the unbalanced port. The balun and the filter stage are formed on the substrate.

Filter circuit with a filter stage and balun on a single substrate

An acoustic mirror is described which is formed of at least one first insulating layer, a first metal layer disposed thereon, a second insulating layer disposed thereon and a second metal layer disposed thereon. An auxiliary layer is produced on the first insulating layer whereby a recess extending as far as the first insulating layer is created therein. The first metal layer is substantially deposited and removed by chemical/mechanical polishing until the parts of the first metal layer disposed outside the recess are no longer present. The second metal layer is also produced in a recess with the aid of chemical/mechanical polishing. More than two insulating layers and two metal layers can be provided. The first metal layer and the second metal layer can be produced in the same recess.

Acoustic mirror and method for producing the acoustic mirror

A micromechanical sensor integrated on a chip, includes a semiconductor substrate, an electronic circuit, a void, a diaphragm, a counterelectrode and valve openings connecting a volume of the void to its surroundings. The valve openings are directed toward an upper surface of the wafer, and the counterelectrode is a component part of a coating plane that extends over the entire chip surface, so that the electronic semiconductor circuit can be applied to the coating plane by known semiconductor technology. A method for producing the micromechanical sensor as well as a microphone or a pressure sensor having the micromechanical sensor, are also provided.

Micromechanical sensor and method for producing the same

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Ottobrunn, Germany

Hans-Jörg Timme