Infineon Technologies Ag

Infineon Technologies Austria Ag

Siemens Aktiengesellschaft

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Avago Technologies Wireless Ip, Pte. Ltd.

Contria San Limited Liability Company

Hans-Joerg Timme

Hans-Joachim Schulze

Ruediger Bauder

Helmut Strack

Anton Mauder

Peter Pfann

Stefan Helmut Schmalzl

Guenther Ruhl

Robert Aigner

Stephan Marksteiner

Lueder Elbrecht

Andreas Bogner

Joachim Mahler

Frank Dieter Pfirsch

Edward Fuergut

Wolfgang Werner

Manfred Engelhardt

Werner Robl

Martin Handtmann

Winfried Nessler

Rainer Winkler

Franz Hirler

Ralf Otremba

Francisco Javier Santos Rodriguez

Khalil Hosseini

Juergen Hoegerl

Reinhard J Stengl

Ivan Nikitin

Alexander Heinrich

Carsten Ahrens

Stefan Barzen

Dirk Meinhold

Irmgard Escher-Poeppel

Alexander Frey

Frank Daeche

Christine Dehm

Reimund Engl

Alexander Roth

Peter Scherl

Gerhard Poeppel

Matthias Friedrich Herrmann

Norbert Urbansky

Thomas Kunstmann

Hannes Eder

Magdalena Hoier

Alfred Vater

Manfred Frank

Norbert Mais

Stephan Henneck

Jonathan Binder

Ivan Nikitn

Klaus Penner

Jun Cheng Ooi

In accordance with an embodiment, an RF system includes a transmit path having a first tunable transmit band stop filter, and a power amplifier coupled to an output of the first tunable transmit band stop filter, where the first tunable transmit band stop filter is configured reject a receive frequency and pass a transmit frequency; a receive path comprising an LNA; and a duplex filter having a transmit path port coupled to an output of the power amplifier, a receive path port coupled to an input of the LNA, and an antenna port, where the duplex filter is configured to pass the transmit frequency and reject the receive frequency between the antenna port and the transmit path port, pass the receive frequency and reject the transmit frequency between the antenna port and the receive path port.

System and method for a radio frequency filter

Methods for manufacturing resonator structures and corresponding resonator structures are described. A first wafer including a first piezoelectric material is singulated and bonded to a second wafer.

Method for fabricating resonator structure and resonator structure

A notch filter includes a first inductor coupled between an input node and an output node, a dual-resonator structure coupled between the input node and the output node, and a second inductor coupled between the dual-resonator structure and ground, and a bandpass filter includes a capacitor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.

Acoustically coupled resonator notch and bandpass filters

A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second or third resonator or both. The first resonator has terminals for incorporation in a filter structure. A tuning circuit is coupled to the second or third resonator or both to enable tuning of the resonator element. The tuning circuit includes a variable capacitor and an inductor.

Tunable resonator element, filter circuit and method

In accordance with an embodiment, an RF system includes a transmit path having a transmit RF filter and an adjustable transmit phase shifter/matching network coupled between the transmit RF filter and a transmit antenna port, where the adjustable transmit phase shifter/matching network is configured to transform an impedance of the transmit RF filter at a receive frequency from a first lower impedance to a first higher impedance at the transmit antenna port; and a receive path having a receive RF filter and an adjustable receive phase shifter/matching network coupled between the receive RF filter and a receive antenna port, where the adjustable receive phase shifter/matching network is configured to transform an impedance of the receive RF filter at a transmit frequency from a second lower impedance to a second higher impedance at the receive antenna port.

A notch filter includes an inductor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.

A bandpass filter includes a capacitor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.

In accordance with an embodiment, a method of operating an RF system includes generating a first RF signal having a first frequency; filtering the generated first RF signal to form a first filtered transmitted signal; producing a first coupled signal and a first transmitted signal from the first filtered transmitted signal; transmitting the first transmitted signal; transmitting a second RF signal having a second frequency; bandpass filtering the first coupled signal to form a first tunable bandpass filtered signal; and measuring a parameter of the first tunable bandpass filtered signal.

In accordance with an embodiment, a method of operating an RF system includes filtering a first wideband RF signal using a wideband filter bank. Filtering the first RF signal includes separating the first wideband RF signal into frequency cluster signals, where each frequency cluster signal of the frequency cluster signals includes different frequency ranges, the first wideband RF signal includes multiple RF bands, and each of the different frequency ranges comprises a plurality of RF bands of the multiple RF bands. The method further includes band stop filtering at least one of the frequency cluster signals to produce a band stopped frequency cluster signal.

In accordance with an embodiment, a method of operating an RF system includes filtering a wideband RF signal using an adjustable center frequency bandpass filter to produce a filtered RF signal; amplifying the filtered RF signal to produce an amplified RF signal; and band stop filtering the amplified RF signal to produce a band stopped RF signal.

A module is disclosed. In one example, the module includes a carrier, an at least partially thermally conductive and electrically insulating body mounted on only a part of a main surface of the carrier, an at least partially electrically conductive redistribution structure on the thermally conductive and electrically insulating body, an electronic chip mounted on the redistribution structure and above the thermally conductive and electrically insulating body, and an encapsulant encapsulating at least part of the carrier, at least part of the thermally conductive and electrically insulating body, at least part of the redistribution structure, and at least part of the electronic chip.

Chip module with spatially limited thermally conductive mounting body

A resonator is described including a piezoelectric material with first and second electrodes provided on the piezoelectric material. An acoustic metamaterial at least partially surrounds an active region of the resonator.

Resonator and method for providing resonator

A resonator element for use in a filter is provided. The resonator element includes a first resonator acoustically coupled to a second resonator. The first resonator has terminals for incorporation in a filter structure. A tuning circuit is coupled to the second resonator to enable tuning of the resonator element.

A semiconductor device includes a transistor having a plurality of transistor cells in a semiconductor body. Each transistor cell includes a control terminal and first and second load terminals. The transistor further includes a phase change material exhibiting a solid-solid phase change at a phase transition temperature Tbetween 150&#xb0; C. and 400&#xb0; C. The control terminals of the plurality of transistor cells are electrically connected to one another.

Semiconductor device including a phase change material

Growing community of inventors

Ottobrunn, Germany

Hans-Joerg Timme