Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Hans Joachim Quenzer

Bernd Wagner

Ulrich Hofmann

Wolfgang Reinert

Peter Merz

Marten Oldsen

Shanshan Gu-Stoppel

Vanessa Stenchly

Uwe Bott

Thomas Lisec

Wolfgang Benecke

Joachim Janes

Xihe Tuo

The invention relates to a method for producing optical components, wherein a first contact surface is formed by bringing a deformation element into contact with a carrier; and a second contact surface is formed by applying a functional element to the deformation element; said second contact surface at least partially overlapping the first contact surface, so that a deformation zone is formed by the area of the deformation element that lies between the overlapping areas of the two contact surfaces, wherein at least one portion of the deformation zone is heated and deformed in such a way that the functional element is deflected, in particular, shifts and/or tilts, and the functional element is joined with the deformation element during the process step of applying the functional element to the deformation element and/or during the process step of heating and deforming the deformation zone.

Method for producing optical components using functional elements

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

Method of producing a cap substrate, and packaged radiation-emitting device

The method according to the invention is used for producing optical components, in particular covers for encapsulating micro-systems, wherein at least one reinforcing element, which is produced before being arranged, is arranged on a first substrate, as a result of which a stack is produced. This stack is heated after being connected to a second substrate, as a result of which the first substrate is deformed such that at least one region, covered by the reinforcing element, of the first substrate is moved and/or is inclined or the first substrate is brought into contact with the reinforcing element. In an alternative method according to the invention, the reinforcing element is arranged on the second substrate, wherein this stack is then connected to the first substrate. The first substrate is subsequently heated and deformed such that a region of the first substrate is brought into contact with the reinforcing element.

Method for producing structured optical components

The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.

Device comprising a vibratably suspended optical element

The invention relates to an MEMS structure with a stack made of different layers and a spring-and-mass system varying in its thickness which is formed of the stack, and wherein, starting from a back side of the stack and the substrate, at laterally different positions, the substrate while leaving the first semiconductor layer, or the substrate, the first etch-stop layer and the first semiconductor layer are removed, and to a method for manufacturing such a structure.

Device comprising a spring and an element suspended thereon, and method for manufacturing same

The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.

Cover for microsystems and method for producing a cover

Disclosed is a method for producing single microlenses or an arrays of microlenses composed of a glass-type material, in which method a first substrate is provided with a surface containing impressions over which a second substrate composed of a glass-type material is placed at least partially overlapping it and is joined therewith under vacuum conditions. The substrate composite is tempered in such a manner that the second substrate softens and flows into the impressions of the first substrate, thereby structuring the side of the second substrate facing away from the first substrate in order to form at least one microlens surface.

Method for producing single microlenses or an array of microlenses

A method of creating a predefined internal pressure within a cavity of a semiconductor device, the method including providing the semiconductor device, the semiconductor device including a semiconductor oxide area which is continuously arranged between the cavity of the semiconductor device and an external surface of the semiconductor device, exposing the semiconductor device to an ambient atmosphere with a noble gas at a first temperature for a predetermined time period, and setting a second temperature, which is different from the first, after the predetermined time period has expired, the semiconductor oxide area exhibiting a higher permeability for the noble gas at the first temperature than at the second temperature.

Method of creating a predefined internal pressure within a cavity of a semiconductor device

A tunable high-frequency capacitor includes first and second fixed electrodes, the first fixed electrode having a high-frequency input connection, and the second fixed electrode having a high-frequency output connection. A movable electrode is arranged facing and spaced apart from the fixed electrodes and is supported by means of a suspension which causes a displacement of the movable electrode in relation to the fixed electrode depending on a control signal that is applied.

Tunable high-frequency capacitor

A sensor element for electrically measuring the position of liquid levels, comprising a substrate ( ) and a plurality of electrodes ( ) that can be contacted individually and that are mounted on the substrate, characterized in that the electrodes comprise sensor-active partial electrodes ( ) that are networked with electrical connections ( ), with the partial electrodes of two respective electrodes always being positioned opposite one another, separated by a distance, as partial electrode pairs ( ) and with the electrode pairs ( ) thus formed recurring periodically over the length of the sensor. Quasi-digital measuring methods are derived from the behavior of the impedance of the electrode pairs, whereby the liquid level is measured by detecting a conductivity boundary in a capillary filling.

Microsensor for measuring the position of liquids in capillaries

The invention relates to a micro reactor arrangement, particularly for a micro relay. It comprises a substrate ( ) with two thermomechanical micro actuators ( ). In response to thermal stimulation, the first micro actuator ( ) performs a movement in parallel with the substrate surface ( ), while the second micro actuator moves in a direction orthogonal on the substrate surface ( ). Both thermomechanical micro actuators are so disposed relative to each other that the first micro actuator ( ), in the extended state, reaches under the second micro actuator ( ). With these provisions, the first micro actuator ( ) can be maintained in this position without supply of power when the second micro actuator ( ) is de-energized. With the present micro actuator arrangement, one can achieve the advantages of a high activation force and long positioning travels of thermomechanical micro actuators for micro relays, without the necessity to supply energy for maintaining the individual switching states.

Microactuator arrangement

A bistable electrostatic actuator with pneumatic or liquid coupling. The actuator has enclosed metallic electrodes. It can be used for a microvalve or micropump. The actuator has buckled membrane sections in pairs and curved substrate electrodes, locally associated with said membrane sections.

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Itzehoe, Germany

Hans Joachim Quenzer