Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Hans-Joachim Quenzer

Peter Merz

Ulrich Hofmann

Thomas Lisec

Bernd Wagner

Arne Schulz

Joachim Janes

Vanessa Stenchly

Wolfgang Reinert

Marten Oldsen

Shanshan Gu-Stoppel

Norman Marenco

Thomas Von Wantoch

Dirk Weiler

Uwe Bott

Gundula Piechotta

Beatrice Wenk

Felix Heinrich

Tim Reimer

Arne-Veit Schulz

Carola Dell

Arne Veit Schulz-Walsemann

Björn Jensen

Amit Kulkarni

Norman Laske

Robert Leitel

Gerfried Zwicker

Robert Brüning

Martin Hubold

Dirk KÄHLER

Arne Veit Schulz

A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.

Method for producing lens elements and packaged radiation-sensitive devices on wafer level

The invention relates to a MEMS mirror assembly for detecting a large angular range up to 180&#xb0;, preferably up to 160&#xb0;, and to a method for producing a MEMS mirror assembly. The mirror assembly comprises a carrier substrate (), on which a mirror () vibrating about at least one axis is mounted, a transparent cover (), which is connected in a hermetically sealed manner to the carrier substrate () and which comprises an ellipsoidal dome () having a substantially round base area, and a compensation optical system (), which is arranged in a predefined beam path for an incident beam outside the dome (). The middle of the mirror () lies in the centre point of the dome, and the compensation optical system () collimates the incident beam in such a way that a divergence or convergence of the beam caused by the boundary surfaces of the dome once said beam has exited from the dome () is substantially compensated. The MEMS mirror assemblies are produced by joining a cover wafer and a mirror wafer, which each comprise a plurality of hemispherical domes and mirrors mounted on the carrier substrate. The mirror assemblies are then separated from the joined wafers. The domes of the cover wafer are produced by a glass flow process.

MEMS mirror arrangement for detecting a large angular range

A method for manufacturing a device having a three-dimensional magnetic structure includes applying or introducing magnetic particles onto or into a carrier element. A plurality of at least partly interconnected cavities are formed between the magnetic particles, which contact one another at points of contact, by coating the arrangement of magnetic particles and the carrier. The cavities are penetrated at least partly by the layer generated when coating, resulting in the three-dimensional magnetic structure. A conductor loop arrangement is provided on the carrier or a further carrier. When a current flows through the conductor loop, an inductance of the conductor loop is changed by the three-dimensional magnetic structure, or a force acts on the three-dimensional magnetic structure or the conductor loop by a magnetic field caused by the current flow, or when the position of the three-dimensional magnetic structure is changed, a current flow is induced through the conductor loop.

Method for manufacturing a device having a three-dimensional magnetic structure

This invention provides a microsystem comprising a porous thermal insulation body composed of particles of low thermal conductivity. The porous body isolates and stabilizes the microsystem.

Thermally insulated microsystem

A converter assembly for converting a primary light into a secondary light includes at least one element which has a light-converting structure with open pores and which is laterally held by a frame. The surfaces of both the light-converting structure as well as of the inner face of the frame are covered with a transparent layer such that each of the afore-mentioned elements forms a region in which a property of the incident light and preferably of the wavelength thereof is changed. In specific embodiments, the converter assembly can be part of display assemblies or of miniaturized components for example. There is also described a method for producing the converter assembly.

Converter for generating a secondary light from a primary light, light-emitting elements which contains such a converter, and method for producing the converter and the light-emitting elements

Embodiments of the present invention provide an apparatus including a micromirror, an excitation structure containing or supporting the micromirror, and at least one piezoelectric sensor. The excitation structure includes at least one piezoelectric actuator, the excitation structure being configured to resonantly excite the micromirror so as to cause a deflection of the micromirror. The at least one piezoelectric sensor is configured to provide a sensor signal dependent on the deflection of the micromirror, the piezoelectric sensor being connected to the excitation structure so that during the resonant excitation of the micromirror, the sensor signal and the deflection of the micromirror exhibit a fixed mutual phase relationship.

Piezoelectric position sensor for piezoelectrically driven resonant micromirrors

A micromirror system that includes a chip frame, at least one spring element, and at least one mirror plate oscillatorily suspended in the chip frame via the at least one spring element. The chip frame and the at least one spring element include at least one microchannel which is provided with an inlet opening and an outlet opening for leading through a flowing coolant.

Micromirror system and method of manufacturing a micromirror system

The present invention relates to a method for producing a miniaturized separation column for chromatographic purposes including a porous stationary phase anchored in the column, including the following steps:

Chip produced at wafer level for liquid chromatography and method for the production thereof

The invention is a method for structuring a flat substrate composed of glass material in the course of a viscous flow process. The glass flat substrate is joined to a surface of a flat substrate, which is preferably a semiconductor flat substrate, having at least one depression bounded by a circumferential edge located in the surface. In the course of a subsequent tempering process, glass material is changed to a viscous free-flowing state in which at least proportions of the free-flowing glass material of the flat substrate flow over the circumferential edge into the depression in the flat substrate. The invention is also characterized in that a flat substrate is provided of which the at least one depression has at least one wetting surface that is countersunk with respect to the surface of the flat substrate and is at least partly bounded by a line-type edge which, at the same time, is an edge of a trench structure provided within the depression and countersunk with respect to the wetting surface and/or is determined by a discontinuous change in a wetting property for the free-flowing glass material that can be assigned to the wetting surface.

Method for structuring a flat substrate composed of glass-type material, and optical component

Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.

Method for treating the surface of an electrically conducting substrate surface

The invention relates to a microsystem having at least one micromirror () and at least one micromirror actuator () for pivoting the at least one micromirror () about at least one axis from a relaxed resting position, comprising a frame chip and a transparent cover () disposed on the frame chip, wherein the frame chip has a chip frame (), on which the at least one micromirror () is articulated in an elastically pivoting manner, wherein the at least one micromirror () is further disposed within the chip frame () and in a cavity () that is formed between the transparent cover () and a carrier layer. To this end, the at least one micromirror () is articulated on a frame () pivotally about the at least one axis, the frame () in turn being pivotally articulated on the chip frame (), wherein the frame () is permanently pivoted out of a chip plane defined by the carrier layer such that the micromirror () in the resting position thereof is tilted about a non-pivoting angle relative to the chip plane. The invention further relates to a method for the production of such a microsystem.

Microsystem and method for the production of a microsystem

A method and a device are disclosed for follow-up treatment of the contour of the surface of at least one optical lens, in particular a microlens which is made of glass or a glass-type material and which has a convex lens surface delimited by a circumferential line abutting on a plane section surrounding the circumferential line and which has a lens underside facing the convex lens surface. Along the circumferential line of the optical lens on the plane section is placed a device perfectly matching the circumferential line and at least laterally bordering the convex lens surface, the optical lens is heated to a temperature of at least the transformation temperature of glass or glass-type material, pressure equalization prevails between the convex lens surface and the lens underside, after a certain period of time, during which the optical lens undergoes the temperature treatment and subsequent cooling below the transformation temperature, the device is removed from the optical lens.

Method and device for selectively changing the contour of the surface of an optical lens made of glass or a glass-type material

Disclosed is a method for structuring a flat substrate consisting of a glass-type material. The invented method is distinguished by a combination of the following steps: providing a semiconductor flat substrate consisting of a semiconductor material, structuring at least one surface of said semiconductor flat substrate to obtain recesses in said surface, connecting said surface of said semiconductor flat substrate to said glass-type flat substrate, with said structured surface of said semiconductor flat substrate being connected to a surface of said glass-type flat surface at least partially covering the same,tempering said connected flat substrates in such a manner that at least a part of the said glass-type material flows into said recesses of said structured surface of said semiconductor flat substrate,removing material at least from the resolidified glass-type flat substrate in such a manner that said glass-type flat substrate assumes a surface which is flush with said structured surface of said semiconductor flat substrate.

Method for structuring a flat substrate consisting of a glass-type material

What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Method for producing micromechanical and micro-optic components consisting of glass-type materials

A beam-shaping element comprises a carrier substrate () bearing a thin-layer metallization which is structured for shaping the beam of optical radiation. The thin-layer metallization includes at least two metallic layers (), which, upon impingement of the optical radiation (), react with each other accompanied by a permanent change in color in response to a certain intensity and/or an irradiation period of the optical radiation ().

Growing community of inventors

Itzehoe, Germany

Hans-Joachim Quenzer