Infineon Technologies Ag

Intel Corporation

Intel Deutschland Gmbh

International Business Machines Corporation

Intel Mobile Communications Gmbh

Infineon Technologies LLC

United Microelectronics Co.

Google Inc.

Hans-Joachim Barth

Jens G Pohl

Helmut Horst Tews

Thorsten Meyer

Gottfried Beer

Erdem Kaltalioglu

Sven Albers

Gerald R Friese

Heinrich Koerner

Petra Felsner

Werner Robl

Jan Proschwitz

Bastiaan Elshof

Peter Baumgartner

Mathias Vaupel

Rainer Steiner

Oliver Nagy

Reinhard Mahnkopf

Philipp Riess

Snezana Jenei

Harald Gossner

Bernd Waidhas

Markus Brunnbauer

Bernd Adler

Michael P Skinner

Andre Hanke

Juergen Holz

Wolfgang Molzer

Alexander Von Glasow

Jürgen Holz

Hans-Gerd Jetten

Joern Plagmann

Jiro Morinaga

Georg Seidemann

Yen Hsiang Chew

Kooi Chi Ooi

Harald Seidl

Matthias Hierlemann

Howe Yin Loo

Lloyd G Burrell

Thomas Schafbauer

Edmund Goetz

Thomas Benetik

Erwin Ruderer

Teodora Ossiander

Bernd Memmler

Andreas Rusch

Klaus Schrüfer

Christian Mueller

Uwe Kerst

Dirk Plenkers

Chih-Chao Yang

Hsueh-Chung Chen

Chih-Chien Liu

Andreas Wolter

Thomas Schulz

Gerald Ofner

Tong-Yu Chen

Klaus Reingruber

Mark Hoinkis

Martin Ostermayr

Sonja Koller

Andreas Augustin

Henry Atkinson Nye, Iii

Axel Brintzinger

Douglas Wayne Kemerer

Gwo-Shii Yang

Klaus Schruefer

Jen Hui Chen

Joseph L Chan

Klaus Von Arnim

Chiung-Sheng Hsiung

Pak Leung

Horst Baumeister

Emmanuel F Crabbe

Alexander Olbrich

Sergei Postnikov

Michael Stetter

David K Anderson

Reinhard Golly

Yi-hsiung Lin

Jesenka Veledar Krueger

Bernd Ebersberger

Joem Plagmann

Jenei Snezana

Christian Müller

Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

Snap button fastener providing electrical connection

Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.

Wearable electronic devices and components thereof

A semiconductor device includes a substrate having a top surface. A semiconductor circuit defines a circuit area on the top surface of the substrate. An interconnect is spaced apart from the circuit area and extends from the top surface into the substrate. The interconnect includes a sidewall formed of an electrically insulating material. An opening is provided in the sidewall.

Method of manufacturing of a sidewall opening of an interconnect of a semiconductor device

Embodiments of the present disclosure are directed towards techniques and configurations for hybrid carbon-metal interconnect structures in integrated circuit assemblies. In one embodiment, an apparatus includes a substrate, a metal interconnect layer disposed on the substrate and configured to serve as a growth initiation layer for a graphene layer and the graphene layer, wherein the graphene layer is formed directly on the metal interconnect layer, the metal interconnect layer and the graphene layer being configured to route electrical signals. Other embodiments may be described and/or claimed.

Hybrid carbon-metal interconnect structures

Some forms relate to wearable computing devices that include a 'touch pad' like interface. In some forms, the example wearable computing devices may be integrated with (or attached to) textiles (i.e. clothing). In other forms, the example wearable computing devices may be attached directly to the skin of someone (i.e., similar to a bandage) that utilizes any of the example wearable computing devices. The example wearable computing devices include a flexible touch pad that may allow a user of the wearable computing device to more easily operate the wearable computing device. The example wearable computing devices described herein may include a variety of electronics. Some examples include a power supply and/or a communication device among other types of electronics.

Wearable computing device

Generally, this disclosure provides systems, devices, methods and computer readable media for accident avoidance during mobile device usage. The mobile device may include a processor, a camera, one or more sensors, and accident avoidance circuitry. The accident avoidance circuitry may include user focus detection circuitry configured to detect that an application executing on the processor requires attention focus of a user of the mobile device; motion detection circuitry configured to determine motion of the mobile device based on input from the camera or from the one or more sensors; obstacle detection circuitry configured to detect obstacles in the path of the determined motion of the mobile device based on input from the camera; and warning generation circuitry configured to generate an alarm to the user based on the detected user attention focus, the determined motion and the detected obstacles.

System and method for accident avoidance during mobile device usage

Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

Flow diversion devices

A capacitive sensor and measurement circuitry is described that may be able to reproducibly measure miniscule capacitances and variations thereof. The capacitance may vary depending upon local environmental conditions such as mechanical stress (e.g., warpage or shear stress), mechanical pressure, temperature, and/or humidity. It may be desirable to provide a capacitor integrated into a semiconductor chip that is sufficiently small and sensitive to accurately measure conditions expected to be experienced by a semiconductor chip.

Detection of environmental conditions in a semiconductor chip

Structures and methods of forming moisture barrier capacitor on a semiconductor component are disclosed. The capacitor is located on the periphery of a semiconductor chip and includes an inner plate electrically connected to a voltage node, an outer plate with fins for electrically connecting to a different voltage node.

Moisture barrier capacitors in semiconductor components

Growing community of inventors

Munich, Germany

Hans-Joachim Barth