Intel Corporation

Institute for the Development of Emerging Architectures, L.l.c.

Idea Corporation

Hans J Mulder

Harshvardhan P Sharangpani

Edward Thomas Grochowski

Shekhar Yeshwant Borkar

Robert S Dreyer

Tse-Yu Yeh

Kent G Fielden

Dale Calvin Morris

Gary N Hammond

Donald B Alpert

Michael Paul Corwin

Judge K Arora

Mircea Poplingher

Vincent E Hummel

Calvin E Wells

Naomi Obinata

Michael S Schlansker

Rajiv Gupta

Derrick Chu Lin

Ralph Michael Kling

Wenliang Chen

Ken Arora

James Hull

In one method, a predicted predicate value may be determined. A predicated instruction is then conditionally executed depending on the predicted predicate value. For example, in accordance with one embodiment of the present invention, a predicate table stores historical information corresponding to a predicate. A pipeline coupled to the table receives a predicted predicate value calculated from the historical information. The pipeline may use this predicted predicate value to conditionally execute a predicated instruction. The actual predicate value is provided back to the predicate table from the pipeline.

Predicate prediction based on a predicated predicate value

In one method, a predicted predicate value for a predicate is determined. A predicated instruction is then conditionally executed depending on the predicted predicate value.

Method and apparatus for performing predicate prediction

A method and apparatus for performing predicate prediction. In one method, both a predicted predicate value for a predicate and a confidence value for the predicted predicate value are determined.

An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided is an apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided is an apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided is an apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Method and apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply

A dispersal unit in combination with a chain affinity unit and an intra-cycle dependency analyzer routes instructions in a microprocessor in order to improve microprocessor performance. The dispersal unit routes instructions to a particular cluster in the microprocessor in response to information stored in the chain affinity unit. The intra-cycle dependency analyzer identifies dependencies in groups of instructions to the dispersal unit, and the dispersal unit routes instructions in the group based on those dependencies.

Method and apparatus for efficiently routing dependent instructions to clustered execution units

Method and apparatus for predicting a predicate based on historical information and the least significant bits of operands to be compared

In one method, a predicted predicate value for a predicate is determined. A predicated instruction is then conditionally executed depending on the predicted predicate value. For example, in accordance with one embodiment of the present invention, a predicate table stores historical information corresponding to a predicate. A pipeline coupled to the table receives a predicted predicate value calculated from the historical information. The pipeline may use this predicted predicate value to conditionally execute a predicated instruction. The actual predicate value is provided back to the predicate table from the pipeline.

A method for processing one or more branch instructions in an instruction bundle is provided. The instructions are ordered in an execution sequence within the bundle, with the branch instructions ordered last in the sequence. The bundled instructions are transferred to execution units indicated by a template field that is associated with the bundle. The first branch instruction in the bundle's execution sequence that is resolved taken is determined, and retirement of subsequent instructions in the execution sequence is suppressed.

Instruction template for efficient processing clustered branch instructions

A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Apparatus for retrofit mounting a VLSI chip to a computer chassis for

A system which includes a chassis having a first side and a second side; a circuit board having a set of components, the first circuit board mounted on the first side of the chassis; an integrated circuit package mounted on the second side of the chassis; and a set of electrical connections providing a communications network between the circuit board and the integrated circuit package; wherein the integrated circuit package is thermally coupled to the second side of the chassis.

System for connecting subsystems of dissimilar thermal properties

A microprocessor for efficient processing of instructions in a program flow including a conditional program flow control instruction, such as a branch instruction. The conditional program flow control instruction targets a first code section to be processed if the condition is resolved to be met, and a second code section to be processed if the condition is resolved to be not met. A fetch unit fetches instructions to be processed and branch prediction logic coupled to the fetch unit predicts the resolution of the condition. The branch prediction logic of the invention also determines whether resolution of the condition is unlikely to be predicted accurately. Stream management logic responsive to the branch prediction logic directs speculative processing of instructions from both the first and second code sections prior to resolution of the condition if resolution of the condition is unlikely to be predicted accurately. Results of properly executed instructions are then committed to architectural state in program order. In this manner, the invention reduces the performance penalty related to mispredictions.

Processor and method for speculatively executing instructions from

An apparatus includes a clock to produce pulses and an electronic hardware structure having a plurality of rows and one or more ports. Each row is adapted to record a separate latency vector written through one of the ports. The latency vector recorded therein is responsive to the clock. A method of dispatching instructions in a processor includes updating a plurality of expected latencies to a portion of rows of a register latency table, and decreasing the expected latencies remaining in other of the rows in response to a clock pulse. The rows of the portion correspond to particular registers.

Scheduling instructions with different latencies

Apparatus for mounting a chip package to a chassis of a computer

An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are an apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are an apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are an apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Growing community of inventors

San Francisco, CA, United States of America

Hans J Mulder