Hesse & Knipps Gmbh

Hans Hesse

Piotr Vasiljev

Jörg Wallaschek

An ultrasonic transducer having an ultrasonic conducting element with a plurality of arms extending from a common junction with some of the arms being provided with ultrasonic generators, at least one other arm carrying a bonding tool, especially for bonding a conductor to a chip and at least two of the arms including a straight angle of 180&#xb0; with one another.

Cruciform ultrasonic transducer

In the forms of a flip-chip package in which the contact elements of the chip are ultrasonically welded to the contact elements of the substrate, either the chip or the substrate or both are provided, prior to juxtaposition, with a bonding material which can be ultrasonically activated. During the ultrasonic welding process in which the contact elements of the chip and substrate are bonded together, the bonding material provides an additional attachment between the chip and substrate and eliminates the need for underfilling.

Growing community of inventors

Paderborn, Germany

Hans Hesse