Bell Telephone Laboratories

At&t Bell Laboratories

Lucent Technologies Inc.

American Telephone & Telegraph Co., At&t Bell Laboratories

Hans H Ammann

Michael A Oien

Richard F Kovacs

Everett F Simons

Henry B Micks, Jr

Francis LoVasco

John G Tetz

Jamey N Potechin

Rocco Bonanni

Werner Engelmaier

Richard C Steines

Kwokming J Cheng

Panels are positioned relative to a pattern by moving the pattern onto a registration mechanism having contact elements, engaging contact areas on the pattern with contact elements by moving the contact elements synchronously and equidistantly while allowing the registration mechanism to move as the elements engage the contact areas, locking the position of the registration mechanism, and engaging contact areas on sequential panels by moving the contact elements of the locked registration mechanism synchronously and equidistantly to contact areas on one panel after the other.

Panel positioning method

Panel positioning method and apparatus

Phototools are located for processing both sides of printed circuit board panels by an apparatus and process that utilizes a work station with two alignment fixtures each including panel center registration PCR alignment mechanism to locate phototools and panels. Processing steps utilize the alignment fixtures to locate phototools on both sides of a panel. Each of the two phototools is initially positioned on its alignment fixture by the PCR alignment mechanism and secured to its alignment fixture by means of a vacuum supplied by a vacuum chuck which is operative as the top surface of the alignment fixture. The panel is then placed on top of the first phototool and aligned to the first phototool in the first alignment fixture using the PCR alignment mechanism. This first phototool is then affixed to the first side of the panel. The panel with the attached first phototool is then placed on the second phototool in the second alignment fixture and aligned to the second phototool using the PCR alignment mechanism. The second phototool is then affixed to the second side of the panel. The phototool-panel-phototool package is then placed in a printer for exposure.

Method and apparatus for aligning phototools for photoprocessing of

A metrology system to analyze panel misregistration in a panel manufacturing process includes a software controlled system which checks defined panel parameters on the four corners of a panel and related artwork for processing with a master pattern etched on a glass reference with a machine vision measuring system. The panel or artwork being checked is positioned by panel center registration means to align the center of the panel with the center of the master pattern. Displacement and rotational differences are entered under software control into a data base and analyzed by a stored program intelligent analyses system into a plurality of parameters based on a parameter model which permits an analysis of the cause of the misregistration.

Metrology system for analyzing panel misregistration in a panel

A method and apparatus for positioning a locating mechanism and the artwork frame of a panel processing machine has been devised utilizing a flexible beam apparatus for suspending the panel location mechanism and artwork frame which permit these devices to be moved out of the way during loading and unloading panels into and from the work surface of processing machinery. The flexible beam suspending the location mechanism in the disclosed embodiment comprises two parallel surface thin members of resilient sheet material. These members are each attached along one edge to a rigid portion of the machinery and along an opposing edge to the panel locating mechanism. This flexible beam arrangement permits the locating elements of the locating mechanism to be moved from and restored to a previous position with great accuracy. A pair of co-planar high aspect ratio sheet beam members are used to support the artwork frame. One end of these flexible beams is each attached to the machine and an opposing end is attached to the artwork frame. These flexible beam arrangements permit the locating elements and artwork to be moved while panels are inserted into or removed from a work surface of the processing machine and restored to a previous operative position with great accuracy.

Method and apparatus for facilitating loading of a panel processing

A panel locating method engages holes in a panel which are located in the panel symmetrically about a fixed point and axis and applies synchronized opposing displacements of engaging elements to locate and secure the panel on a work surface.

Method for positioning a panel

An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion. The exposed surface of the stainless steel portion can be provided with a ceramic coating to electrically insulate bight portion from the elements to be soldered. The legs of the U-shaped laminate are adapted to be connected to an electric power source through the copper and aluminum layers thereof.

Laminated electric heat generating member for reflow soldering devices

A process and apparatus are disclosed for controlling losses in volatile working fluid systems. In accordance with the process, the object upon which a work operation is to be effected is sequentially moved from a first sealable chamber to a second such chamber and back to the first chamber. While in the second chamber the object is exposed to a working fluid vapor which elevates the temperature of the object to a level near the boiling point of the working fluid. Thereafter, while still in the second chamber, a substantial portion of the working fluid is drained from the object such that the sensible heat acquired by the object upon its elevation of temperature is sufficient to evaporate working fluid remaining on the object upon its removal to the first chamber. Upon removal of the object to the first chamber the object is thoroughly dried through control of the partial pressure of the working fluid vapor contained within the first chamber atmosphere. This control is effected by a closed devaporization loop coupled to the first chamber. In addition, any working fluid which may have been deposited on surfaces within the first chamber is revaporized by auxilliary heating means. Virtually all of this working fluid vapor is recovered by extended devaporization of the atmosphere. Throughout the process any pressure differentials which exist between an internal atmosphere within the first and second chambers and an external atmosphere are equalized by means of a snorkellike member.

Process and apparatus for controlling losses in volatile working fluid

A process and machine are disclosed for reflowing solder plated continuous flexible circuit webs. During reflow in a vapor environment, the flexible web is maintained in a planar orientation to produce a relatively uniform distribution of solder. Virtually all of the heat transfer fluid used in producing the vapor is recovered and retained.

Flexible circuit reflow soldering machine

Flexible circuit reflow soldering process and machine

A tool adapted to simultaneously heat a plurality of spaced electrical elements for soldering includes an elongated heat generating member connected between spaced, parallel, relatively massive and high conductivity rectangular cross section bars. An arcuate lower portion of the heat generating member disposed between the bars is adapted to contact the surface to be soldered. Electrical current applied to one end of one bar and to the opposite end of the other bar is directed uniformly through the heat generating member transverse to the elongated dimension thereof to provide a uniform temperature to all the spaced elements. Upon discontinuation of the electrical current the relatively massive bars are operative to rapidly remove heat from the heat generating member.

Electrically heated soldering device

A tool adapted to simultaneously heat a plurality of spaced electrical elements for soldering includes a rigid low conductivity metallic strip connected between and holding first and second relatively massive high conductivity bars in spaced, parallel relation. The lower portion of the elongated metallic strip is shaped to extend from the bars and contact the elements to be soldered. Electrical current is applied between one end of the first bar and the opposite end of the second bar and is directed through a metallic strip transverse to the elongated dimension. Upon discontinuation of the electrical current, the relatively massive bars rapidly remove heat from the metallic strip.

Growing community of inventors

Chester, NJ, United States of America

Hans H Ammann