Maxim Integrated Products, Inc.

Triquint Semiconductor Corporation

Hans Dropmann

Carlton Stuebing

Walid Y Ali-Ahmad

Garth G Sundberg

Uppili Sridhar

Bonded wafer packages having first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices, the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices, the bonded wafers being diced to form individual sealed devices. The devices may be duplexers, interstage filters or other circuits such as VCOs and RF circuits. Various embodiments are disclosed.

Bonded wafer package module

A system, apparatus and method for providing filtering functionality and impedance transformation within a BAW resonator network are disclosed. In particular, a BAW resonator network is designed to provide bandpass capability and a transformation between its input impedance and output impedance. By effectively integrating impedance matching functionality within the BAW resonator network, discrete impedance matching elements previously required within a system may be removed or reduced in size. As a result, matching networks and their associated component costs, insertion losses, and board size contributions may be reduced. Harmonic termination may be provided within the BAW resonator network or a prematch stage to improve efficiency of a power amplifier.

Harmonic termination of power amplifiers using BAW filter output matching circuits

A system, apparatus and method for providing filtering functionality and impedance transformation within a BAW resonator network are disclosed. In particular, a BAW resonator network is designed to provide band pass capability and a transformation between its input impedance and output impedance. By effectively integrating impedance matching functionality within the BAW resonator network, discrete impedance matching elements previously required within a system may be removed or reduced in size. As a result, matching networks and their associated component costs, insertion losses, and board size contributions may be reduced.

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Emerald Hills, CA, United States of America

Hans Dropmann