Robert Boschgmbh

Paragon

Hans Artmann

Heribert Weber

Hubert Benzel

Frank Schaefer

Thorsten Pannek

Peter Schmollngruber

Jochen Reinmuth

Thomas Friedrich

Christoph Hermes

Arnd Kaelberer

Franz Laermer

Wilhelm Frey

Volkmar Senz

Christian Zielke

Peter Borwin Staffeld

Oliver Breitschaedel

Stefan Pinter

Michael Offenberg

Helmut Baumann

Frank Reichenbach

Arnim Hoechst

Georg Bischopink

Frank Henning

Peter Sudy

Frank Schäfer

Franz Laemer

Robert Siegel

Frank Schaeffer

Uwe Konzelmann

Johannes Classen

Frank Fischer

Frank Schatz

Udo-Martin Gomez

Christian Doering

Hans-Peter Trah

Helmut Sautter

Bernhard Opitz

Julian Gonska

Thomas Wagner

Janpeter Wolff

Ralf Noltemeyer

Mawuli Ametowobla

Juergen Graf

Michael Bauer

Lars Metzger

Kersten Kehr

Andrea Urban

Manfred Moellendorf

Christian Krummel

Remigius Niekrawietz

Tobias Joachim Menold

A micromechanical component for a capacitive pressure sensor device, including a diaphragm that is stretched with the aid of a frame structure in such a way that a cantilevered area of the diaphragm spans a framed partial surface, and including a reinforcement structure that is formed at the cantilevered area. A first spatial direction oriented in parallel to the framed partial surface is definable in which the cantilevered area has a minimal extension, and a second spatial direction oriented in parallel to the framed partial surface and oriented perpendicularly with respect to the first spatial direction is definable in which the cantilevered area has a greater extension. The reinforcement structure is present at a first distance from the frame structure in the first spatial direction, and at a second distance in the second spatial direction, the second distance being greater than the first distance.

Micromechanical component for a capacitive pressure sensor device

A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.

A sensor device having a first counter electrode extending under an intermediate carrier, and having a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region, and the first counter electrode encompassing, under the intermediate carrier, at least one electrically separated region that is disposed below a spacing element and includes at least a lateral extent of the spacing element.

MEMS capacitive sensor including improved contact separation

A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.

Micromechanical component and method for manufacturing a micromechanical component

A method for sealing entries in a MEMS element. The method includes: providing a functional layer having a functional region; producing a cavity underneath the functional region of the functional layer with the aid of a first entry outside of the functional region of the functional layer; sealing the first entry; producing a second entry to the cavity outside of the functional region of the functional layer; melting sealing material in the region of the second entry; and cooling off the melted sealing material to seal the second entry.

Method for sealing entries in a MEMS element

A pivot apparatus, in particular a pivot apparatus for a micromirror, a fixed base frame being connected, directly or indirectly via an intermediate frame, to a pivotable carrier element. Spring elements having flexural springs are respectively disposed between the base frame and carrier element, base frame and intermediate frame, and intermediate frame and carrier element. The use of flexural springs enables good thermal coupling between the individual components, and an increase in robustness. The pivot apparatus can be embodied in particular as a microelectromechanical system.

Pivot apparatus for a micromirror, and illumination apparatus having a pivot apparatus for a micromirror

A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.

Method for producing a multilayer MEMS component, and corresponding multilayer MEMS component

An etching device and an etching method. The etching device includes an etching chamber and a chuck located therein for clamping a substrate to be etched, a plasma generating device surrounding the etching chamber in an area and a gas nozzle distribution device for introducing etching gas, which is situated above the chuck in such a way that an etching gas stream is directed essentially perpendicular to a surface of the substrate to be etched. A moving mechanism may be used to change the distance between the gas nozzle distribution device and the chuck as a function of the etching mode.

Etching device and etching method

A method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure. The method includes provision of a carrier substrate including a first surface, an application of an insulation layer onto the first surface, an epitaxial growth of a first silicon layer onto the insulation layer, a structuring of the first silicon layer for forming trenches in the first silicon layer, a passivation of the first silicon layer, whereby the trenches are filled and a passivation layer is formed on a side facing away from the first surface, a structuring of the passivation layer, sacrificial areas and functional areas being formed in the first silicon layer, and the sacrificial areas are free of the passivation layer, at least at some points, on a side facing away from the carrier substrate, and, finally, removal of the sacrificial areas.

Method for manufacturing microelectromechanical structures in a layer sequence and a corresponding electronic component having a microelectromechanical structure

A comb drive includes a pivotable mirror element, a first and a second comb electrode, the second comb electrode being movable along an offset direction relative to the first electrode from a minimum into a maximum offset position, the second electrode being connected to the mirror element via a lever arm pivotable about a pivot axis, the first and second comb electrodes being interlockingly engaged so that a first comb tooth of the first electrode and a second comb tooth of the second electrode are situated adjacent to one another along a projection direction extending perpendicularly to the offset direction, the first comb tooth and/or the second comb tooth being configured so that an average distance between the first comb tooth and the second comb tooth along the projection direction extending perpendicularly to the offset direction decreases when moving the second electrode from the minimum into the maximum offset position.

Comb drive including a pivotable mirror element

A micromechanical component is described having a first substrate that has a first front side a first rear side facing away from the first front side; first printed conductors that are fashioned on the first front side of the first substrate; a plurality of actuator devices that are fashioned on and/or in the first substrate and that are electrically bonded to the first printed conductors, the actuator devices each having at least one stator electrode and each having at least one actuator electrode that works together with the at least one stator electrode, which are fashioned such that a voltage can be applied between the actuator electrode and cooperating stator electrode in such a way that the actuator electrode can be displaced relative to the stator electrode.

Micromechanical component and method for producing a micromechanical component

A method for producing a semiconductor component includes forming an n-doped layer in a p-doped layer of the semiconductor component, wherein the n-doped layer comprises at least one of: a sieve-like layer or a network-like layer. The method also includes porously etching the p-doped layer between the material of the n-doped layer to form a top electrode, and forming a cavity below the n-doped layer.

Method for producing a semiconductor component and a semiconductor component produced according to the method

A micromechanical method for manufacturing a cavity in a substrate, and a micromechanical component manufactured with this method. In this method, in a first step a first layer is produced on or in a substrate. At least one second layer is then applied onto the first layer. An access hole is produced in this second layer. Material of the first layer and of the substrate can be dissolved out through this hole, so that a cavity is produced in the substrate beneath at least a portion of the second layer. This second layer above the cavity can subsequently be used as a membrane. In addition, the possibility also exists of depositing further layers onto the second layer, only the totality of which layers constitutes the membrane. The material of the first layer is selected so that dissolving out the material of the first layer produces a transition edge in the first layer, which edge at is at a predefinable angle between the substrate and the second layer.

Method for manufacturing a micromechanical component, and micromechanical component

A layer structure for the electrical contacting of a semiconductor component having integrated circuit elements and integrated connecting lines for the circuit elements, which is suitable in particular for use in a chemically aggressive environment and at high temperatures, i.e., in so-called 'harsh environments,' and is simple to implement. This layer structure includes at least one noble metal layer, in which at least one bonding island is formed, the noble metal layer being electrically insulated from the substrate of the semiconductor component by at least one dielectric layer, and having at least one ohmic contact between the noble metal layer and an integrated connecting line. The noble metal layer is applied directly on the ohmic contact layer.

Layer structure for electrical contacting of semiconductor components

A simple to implement contacting variant makes it possible to create a reliable electrical connection between the sensor element and the evaluation electronics of a pressure sensor, including at least one media-resistant sensor element, evaluation electronics in the form of at least one additional component connected electrically to the sensor element, and a multipart housing, the sensor element being situated in a first housing area having at least one pressure connection, and the evaluation electronics being situated in a second sealed housing area which is separated from the first housing area by a separating wall. The electrical connection between the sensor element and the evaluation electronics is implemented in the form of media-resistant bonding wires which are guided from the first into the second housing area through the bonded joint area between the separating wall and an additional housing part.

Pressure sensor

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Magstadt, Germany

Hans Artmann