China Wafer Level Csp Co., Ltd.

Hanqing Hu

Zhiqi Wang

Guoliang Xie

An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

Optical fingerprint recognition chip package and packaging method

A chip package and a chip packaging method are provided. The package includes: a chip to be packaged, a reinforcing layer and solder bumps. The chip to be packaged includes a first surface and a second surface opposite to each other, the first surface includes a sensing region and first contact pads, and the first contact pads are electrically coupled to the sensing region. The reinforcing layer covers the first surface of the chip to be packaged. The solder bumps are provided on the second surface of the chip to be packaged. The solder bump is electrically connected to the first contact pad and is configured to electrically connect with an external circuit.

Growing community of inventors

Jiangsu, China

Hanqing Hu