Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Hannsjorg Obermaier

Chandrakant D Patel

Keunmyung Lee

A multi-layered substrate is manufactured utilizing a sheet material. The sheet material is a dielectric material with a dielectric adhesive coated on one side. A catalyst layer is at a boundary between the dielectric material and the adhesive. The catalyst layer is thin in comparison to the dielectric material and the dielectric adhesive. In the manufacture of the multi-layered substrate, the material is processed using patterning and metallizing steps. During this manufacture the processed sheet material may be supported with a releasable layer. Laminating additional sheet materials onto previously processed sheets produces multiple layers. These additional sheets are then processed. Multiple lamination steps may be performed in order to obtain an end product of a desired number of layers.

Method of manufacturing multilayer substrates

An improved apparatus is disclosed for removing and installing faulty printed circuit cards laterally through a side wall of a computer system, while the remaining cards of the computer system remain under power and operational. The computer system incorporates zero insertion force (ZIF) connectors for receiving the printed circuit cards, and a special interlock mechanism prevents each ZIF connector from being moved from its open position to its closed position until an associated card has been fully installed into the connector. In addition, a special centering mechanism is used to adjustably position the printed circuit card with its electrical contacts precisely aligned with the contacts of the ZIF connector.

On-line replacement apparatus for printed circuit cards

An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via. The connections between the flex signal path and the signal via, and between the flex ground plane and the ground via can be permanent or separable.

Minimal length computer backplane

A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A beam spring applies pressure to the back side of the substrate, maintaining a constant force that urges the chips against the heat sink and avoids mechanical stress that would otherwise result from lateral motion of the chips such as from differential expansion. A flat flexible cable connects the module with other circuitry.

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Los Gatos, CA, United States of America

Hannsjorg Obermaier