At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Hannes Voraberger

Johannes Stahr

Markus Leitgeb

Andreas Zluc

Jonathan Silvano De Sousa

Gerald Weis

Hannes Stahr

Markus Riester

Gerhard Schmid

Bettina Schuster

Simon Sebanz

A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

Component carrier with adhesion promoting shape of wiring structure

A manufacturing method of manufacturing a constituent for a component carrier, wherein the method comprises providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, subsequently, and attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Highly thermally conductive dielectric structure for heat spreading in component carrier

A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.

Embedding component with pre-connected pillar in component carrier

A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps: Furthermore a printed circuit board () or sub-assembly thereof is provided.

Method of manufacturing a printed circuit board

An electric device includes a first structure, a second structure, and a deformed layer. The deformed layer includes a dielectric matrix and electrically conductive elements formed therein. The deformed layer is arranged to electrically couple the first structure with the second structure.

Deformed layer for short electric connection between structures of electric device

A method of manufacturing a printed circuit board or a sub-assembly thereof by coupling at least two elements of insulating materials with different properties on adjacent side surfaces and covering the elements with a layer of conductive material and building up at least one further layer at least partly overlapping the at least two elements.

A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:&#x2014;providing the printed circuit board having a plurality of contact and connection pads,&#x2014;providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and&#x2014;arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.

Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

Growing community of inventors

Graz, Austria

Hannes Voraberger