Abb Schweiz Ag

Hanna Rapinoja

Teemu Salmia

Pyry Hartikainen

Pertti Seväkivi

Jaani Kärppä

A field of enclosures for electronics and electrical components within electric devices, such as electric drive devices for industrial applications, e.g. for working machine and marine applications, and more particularly to an electronics enclosure arrangement for an electric device, and to an electric device. The electronics enclosure arrangement according to the present invention is arranged for an electric device, the electric device including one or more circuit boards and electronics components assembled on the one or more circuit boards, wherein the electronics enclosure arrangement includes an electronics enclosure cover; and an at least one volume element part, arranged in the space between the electronics enclosure cover and the one or more circuit boards with the electronics components.

Electronics enclosure arrangement for an electric device and an electric device

The arrangement includes a pressure relief hatch for closing an opening in a wall in an electric cabinet, which. includes a body having an outer surface, an opposite inner surface, an outer perimeter, and a thickness. The body includes a centre portion with a first thickness, an intermediate portion with a second thickness, and an outer portion with a third thickness. The first thickness is greater than the third thickness and the second thickness decreases in a radially outward direction from the first thickness to the third thickness. A spring keeps the pressure relief hatch in a closed position in the opening during normal operation of the electric cabinet.

Pressure relief arrangement

An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.

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Helsinki, Finland

Hanna Rapinoja